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WANG Ziren, GAO Jinchun, SONG Kaixuan, TIAN Lu, YUAN Yidong. Analysis and modeling of influence of gold wire welding difference on signal transmission[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 73-78, 97. DOI: 10.12073/j.hjxb.20210902001
Citation: WANG Ziren, GAO Jinchun, SONG Kaixuan, TIAN Lu, YUAN Yidong. Analysis and modeling of influence of gold wire welding difference on signal transmission[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 73-78, 97. DOI: 10.12073/j.hjxb.20210902001
shu

Analysis and modeling of influence of gold wire welding difference on signal transmission

  • 1.

    Beijing Key Laboratory of Work Safety Intelligent Monitoring, Beijing University of Posts and Telecommunications, Beijing, 100876, China

  • 2.

    Beijing Smart-chip Microelectronics Technology Co., Ltd., Beijing, 102200, China

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  • Received Date: September 01, 2021
  • Available Online: January 09, 2022
    Graphical Abstract
    • Abstract
  • In the process of ultrasonic thermal bonding, the change of the distance between parallel bonding wires is often ignored. The change of the distance affects high frequency signal transmission significantly, which cannot be ignored. The impact of distance between two parallel bonding wires on signal transmission was studied from perspectives of both model analysis and experimental testing. Based on the size and material parameters of circuit, an electromagnetic field numerical calculation model and an equivalent circuit model of bonding wires with different distances were developed. The relationship between the equivalent inductance and resistance between two connection points was calculated and analyzed with the change of the distance and signal frequency. The influence of the distance between parallel bonding wires on signal integrity of circuits was studied. Finally, experiments were designed to verify the effectiveness of the theoretical model.
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    • References (14)
  • Alimenti F, Mezzanotte P, Roselli L, et al. Modeling and characterization of the bonding-wire interconnection[J]. IEEE Transactions on Microwave Theory and Techniques, 2001, 49(1): 142 − 150. doi: 10.1109/22.899975
    Budka T P. Wide-bandwidth millimeter-wave bond-wire interconnects[J]. IEEE Transactions on Microwave Theory and Techniques, 2001, 49(4): 715 − 718. doi: 10.1109/22.915447
    Laor A, Herrell P J, Mayer M, et al. A study on measuring contact resistance of ball bonds on thin metallization[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(5): 704 − 708. doi: 10.1109/TCPMT.2015.2419981
    Ndip I, Öz A, Reichl H, et al. Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials[J]. IEEE Transactions on Electromagnetic Compatibility, 2015, 57(2): 241 − 249. doi: 10.1109/TEMC.2014.2378284
    Ndip I, Öz A, Guttowski S, et al. Modeling and minimizing the inductance of bond wire interconnects [C]// IEEE 17th Workshop on Signal and Power Integrity. Paris, France, 2013: 1−4.
    Wane S, Tesson O. Compact equivalent circuit derivation of bond wire arrays for power and signal integrity analysis [C]// European Microwave Conference, Munich, Germany, 2007: 524-527.
    Hillebrand J, Kieß S, Wróblewski M et al. S-parameter extraction of bond wires based on EM field simulations of computed tomography-generated 3D CAD models [C]// IEEE 16th Workshop on Signal and Power Integrity. Sorrento, Italy, 2012: 39-42.
    Zhang H, Hong W. A wire bonding structure directly based on substrate integrated waveguide technology[J]. IEEE Microwave and Wireless Components Letters, 2014, 24(11): 757 − 759. doi: 10.1109/LMWC.2014.2350773
    Wang Z, Gao J, Flowers G T, et al. The impact of connection failure of bonding wire on signal transmission in radio frequency circuits[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(10): 1729 − 1737. doi: 10.1109/TCPMT.2020.3019803
    Doerr I, Sommer G, Reichl H. A novel modeling approach for multiple coupled wire bond interconnects [C] //Proceedings of 8th IEEE Workshop on Signal Propagation on Interconnects, Heidelberg, Germany, 2004: 155-158.
    Ndip I, Huhn M, Le T H, et al. Double-wired bond wire antennas [C]//2018 22nd International Microwave and Radar Conference (MIKON). Poznan, Poland, 2018: 216-217.
    Paul C R. 多导体传输线分析(第二版) [M]. 杨晓宪, 郑涛, 译. 北京: 中国电力出版社, 2013.

    Paul C R. Analysis of multiconductor transmission lines 2nd edition [M]. Yang Xiaoxian, Zheng Tao, trans. Beijing: China Electric Power Press, 2013.
    Bogatin E. 信号完整性与电源完整性分析: 第二版 [M]. 李玉山, 刘洋, 译. 北京: 电子工业出版社, 2015.

    Bogatin E. Signal and power integrity: simplified, 2nd edition [M]. Li Yushan, Liu Yang, trans. Beijing: China Electric Power Press, 2015.
    邹澎, 周晓萍. 电磁兼容原理、技术和应用 [M]. 北京: 清华大学出版社, 2017.

    Zou Pong, Zhou Xiaoping. Principle, technology and application of electromagnetic compatibility[M]. Beijing: Tsinghua University Publishing House, 2017.
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