Analysis and modeling of influence of gold wire welding difference on signal transmission

In the process of ultrasonic thermal bonding, the change of the distance between parallel bonding wires is often ignored. The change of the distance affects high frequency signal transmission significantly, which cannot be ignored. The impact of distance between two parallel bonding wires on signal transmission was studied from perspectives of both model analysis and experimental testing. Based on the size and material parameters of circuit, an electromagnetic field numerical calculation model and an equivalent circuit model of bonding wires with different distances were developed. The relationship between the equivalent inductance and resistance between two connection points was calculated and analyzed with the change of the distance and signal frequency. The influence of the distance between parallel bonding wires on signal integrity of circuits was studied. Finally, experiments were designed to verify the effectiveness of the theoretical model.