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WU Jie, XUE Songbai, YU Zhihao, TAN Cheeleong, SUN Huabin, XU Yong. Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(7): 9-13. DOI: 10.12073/j.hjxb.20201211002
Citation: WU Jie, XUE Songbai, YU Zhihao, TAN Cheeleong, SUN Huabin, XU Yong. Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(7): 9-13. DOI: 10.12073/j.hjxb.20201211002
shu

Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint

  • 1.

    Nanjing University of Posts and Telecommunications, Nanjing, 210003, China

  • 2.

    Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

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  • Received Date: December 10, 2020
  • Available Online: April 22, 2021
    Graphical Abstract
    • Abstract
  • The change in shear force and evolution of interfacial microstructure of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint at the temperature 150 ℃ were investigated. The effect of rare earth Nd on the high temperature reliability of the solder joint and the corresponding enhanced mechanism were discussed. The results showed that the shear force of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint was significantly higher than that of Sn-3.8Ag-0.7Cu/Cu solder joint after different aging hours, and the decrease rate of shear force of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint was lower than that of the original solder joint during the aging process. This is because 0.05% Nd could reduce the interfacial diffusion coefficient from 1.88×10−10 cm2/h to 1.10×10−10 cm2/h, that is to say, the high temperature reliability of solder joints could be improved by inhibiting the coarsening of interfacial intermetallic compounds.
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    • References (18)
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