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JIN Fengyang, LI Xiaoyan, YAO Peng. A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 58-63. DOI: 10.12073/j.hjxb.2019400042
Citation: JIN Fengyang, LI Xiaoyan, YAO Peng. A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 58-63. DOI: 10.12073/j.hjxb.2019400042
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A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection

  • College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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  • Received Date: November 19, 2017
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    • Abstract
  • This study focuses on the Cu-Sn-Cu sandwich structure soldering, 0.06 MPa constant pressure. Different soldering temperatures and soldering times were selected based on the Cu-Sn binary phase diagram. After soldering according to different phase composition the solder joints can be divided into three types of residual Sn/Cu3Sn-Cu6Sn5-Cu3Sn/Cu-Cu3Sn-Cu. The relationship among shear strength of solder joints and three different phases compositions were researched by shear experiment of 1 mm/min loading rate and fracture morphology analysis. The results show that the shear strength of solder joints increases with the depletion of Sn and Cu6Sn5 in sequence. The shear strength of residual Sn solder joints, Cu3Sn-Cu6Sn5-Cu3Sn solder joints and Cu-Cu3Sn-Cu solder joints are 23.26, 33.59, 51.83 MPa, respectively. Based on the fracture morphology analysis, residual Sn solder joint fracture can distinguish the morphology of Sn/Cu6Sn5/Cu3Sn, indicating that the crack path through the Cu6Sn5 and Cu3Sn phases. In Cu3Sn-Cu6Sn5-Cu3Sn solder joint fracture, Cu6Sn5/Cu3Sn morphology was distinguished, crack path through the Cu3Sn phase. When only Cu3Sn phase was at solder joints, was Cu3Sn only Cu3Sn can be seen in fracture morphology of the soldering joints.
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