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HE Qingshan, CUI Zhongming, FU Yucan, WANG Zhixin. Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006
Citation: HE Qingshan, CUI Zhongming, FU Yucan, WANG Zhixin. Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006
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Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives

  • 1.

    Henan University of Technology, Zhengzhou, 450001, China

  • 2.

    Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

  • 3.

    National-Local Union Engineering Laboratory of High Efficiency Precision Diamond Cutting Tool Technology, Zhongyuan University of Technology, Zhengzhou, 450007, China

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  • Received Date: November 05, 2019
  • Available Online: July 12, 2020
    Graphical Abstract
    • Abstract
  • The brazing experiments in vacuum furnace were carried by a special method of keeping diamond within the bounds of graphite template, which realized a high bonding strength between steel matrix and diamond and an effective way to control agreed height abrasives. Welded joints and morphology of diamond surface were observed by SEM. Fixed-point and micro-region compositions on the diamond surface were analyzed by EDS. The agreed height abrasives were measured by super-field 3D microscope. Results show that liquefied Cu70Sn20Ti10 solder under capillary action can infiltrate and enclose diamond on the profile of graphite template through splicing and steel matrix have a high holding power for diamond due to the formed TiC on bonding interfaces. Silver colloid and diamond can't generate reaction during brazing process. As silver colloid can always have good bonding and constraint effect for diamond, agreed height of abrasives is satisfactory after brazing process.
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    • References (12)
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