Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints

LIU Shuang; XUE Songbai

doi:10.12073/j.hjxb.20190928002

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2020 > 41(1): 50-54. > DOI: 10.12073/j.hjxb.20190928002

LIU Shuang, XUE Songbai. Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(1): 50-54. DOI: 10.12073/j.hjxb.20190928002

Citation:

PDF (1150 KB)

Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints

LIU Shuang,
XUE Songbai^,

Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

More Information

Received Date: September 27, 2019
Available Online: July 12, 2020

Graphical Abstract

Abstract

Abstract

The effects of Nd addition on the microstructure and mechanical properties of Sn-0.7Cu-0.05Ni/Cu soldered joints under as-reflowed and 150 °C isothermal-aging process were investigated. The results indicated that an appropriate amount of Nd addition could obviously improve the interfacial microstructure and the mechanical properties of Sn-0.7Cu-0.05Ni soldered joints. The optimum properties were obtained while Nd addition was 0.06wt. %. Besides, the growth of the Sn-Cu-Ni/Cu intermetallic compound layer under aging process was restrained by adding 0.06wt.% Nd, which would enhance the reliability of the soldered joints during service process. After aging for 1 440 h, the shear force of Sn-0.7Cu-0.05Ni-0.06Nd soldered joints still ranked the best among all of the tested solders, increased by 31.9% compared to the Nd-free Sn-Cu-Ni soldered joints.
- Nd,
- Sn-Cu-Ni solders,
- microstructure,
- mechanical properties

FullText(HTML)

References (15)

References

张启运. 无铅钎焊的困惑, 出路和前景[J]. 焊接, 2007(2): 6 − 10. doi: 10.3969/j.issn.1001-1382.2007.02.001

Zhang Qiyun. A puzzle in lead free soldering, its outlet and application prospect[J]. Welding & Joining, 2007(2): 6 − 10. doi: 10.3969/j.issn.1001-1382.2007.02.001

Hayes S M, Chawla N, Frear D R. Interfacial fracture toughness of Pb-free solders[J]. Microelectronics Reliability, 2009, 49(3): 269 − 287. doi: 10.1016/j.microrel.2008.11.004

Xu Jiachen, Xue Songbai, Xue Peng, et al. Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd[J]. Journal of Materials Science: Materials in Electronics, 2016, 27(8): 8771 − 8777. doi: 10.1007/s10854-016-4901-y

Hu Xin, Yan Renjun, Shen Wei, et al. Researcl on stress concentration factor of tube joints under pure bending and torsion loading[J]. China Welding, 2019, 28(1): 28 − 34.

Zhao Ning, Liu Xiaoying, Huang Mingliang, et al. Characters of multicomponent lead-free solders[J]. Journal of Materials Science: Materials in Electronics, 2013, 24(10): 3925 − 3931. doi: 10.1007/s10854-013-1340-x

皋利利. 稀土Pr和Nd对SnAgCu无铅钎料组织与性能影响研究[D]. 南京: 南京航空航天大学, 2012.

Liu Shuang, Xue Songbai, Xue Peng, et al. Present status of Sn-Zn lead-free solders bearing alloying elements[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(7): 4389 − 4411. doi: 10.1007/s10854-014-2659-7

Liu Shuang, Xue Songbai. Reliability study of lead-free solders under specific conditions[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(12): 9424 − 9442. doi: 10.1007/s10854-015-3283-x

薛鹏, 周琦, 王克鸿, 等. 复合添加Ga/Nd对超低银SAC钎料组织和性能的影响[J]. 焊接学报, 2016, 37(3): 33 − 36.

Xue Peng, Zhou Qi, Wang Kehong, et al. Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder[J]. Transactions of the China Welding Institution, 2016, 37(3): 33 − 36.

薛鹏, 梁伟良, 王克鸿, 等. 超低银SnAgCu钎料微焊点力学性能[J]. 焊接学报, 2017, 38(12): 29 − 32. doi: 10.12073/j.hjxb.20170903001

Xue Peng, Liang Weiliang, Wang Kehong, et al. Mechanical property of joint soldered with SnAgCu containing ultra-low silver content[J]. Transactions of the China Welding Institution, 2017, 38(12): 29 − 32. doi: 10.12073/j.hjxb.20170903001

Zeng Guang, Xue Songbai, Zhang Liang, et al. A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates[J]. Journal of Materials Science: Materials in Electronics, 2010, 21(5): 421 − 440. doi: 10.1007/s10854-010-0086-y

王俭辛. 稀土Ce对Sn-Ag-Cu和Sn-Cu-Ni钎料性能及焊点可靠性影响的研究[D]. 南京: 南京航空航天大学, 2009.

李广东, 郝虎, 史耀武, 等. 微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响[J]. 电子元件与材料, 2007, 26(11): 49 − 52. doi: 10.3969/j.issn.1001-2028.2007.11.016

Li Guangdong, Hao Hu, Shi Yaowu, et al. Effect of the microelements on the oxidation-resisitance of Sn-0.7Cu lead-free solder[J]. Electronic Components and Materials, 2007, 26(11): 49 − 52. doi: 10.3969/j.issn.1001-2028.2007.11.016

Liu Shuang, Xue Songbai, Zhong Sujuan, et al. Properties and microstructure of Sn-0.7Cu-0.05Ni lead-free solders with rare earth Nd addition[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(2): 1400 − 1410. doi: 10.1007/s10854-018-0410-5

王春青, 李明雨, 田艳红, 等. JIS Z 3198无铅钎料试验方法简介与评述[J]. 电子工艺技术, 2004, 25(2): 47 − 54. doi: 10.3969/j.issn.1001-3474.2004.02.001

Wang Chunqing, Li Mingyu, Tian Yanhong, et al. Review of JIS Z 3198: Test Method for Lead-free Solders[J]. Electronics Process Technology, 2004, 25(2): 47 − 54. doi: 10.3969/j.issn.1001-3474.2004.02.001

Cited By

Cited by

Periodical cited type(2)

1.	薛鹏，何鹏，龙伟民，宋闽. 稀土、Ga元素及其协同效应对无铅钎料组织和性能的影响. 焊接学报. 2021(04): 1-19+97 . 本站查看
2.	吴洁，薛松柏，于志浩，Tan Cheeleong，孙华斌，徐勇. Nd对Sn-3.8Ag-0.7Cu/Cu焊点高温可靠性的影响. 焊接学报. 2021(07): 9-13+97-98 . 本站查看

Other cited types(3)

Get Citation

PDF

XML

Article views (334) PDF downloads (10) Cited by(5)

Turn off MathJax

Article Contents

Abstract

References

Effect of Nd addition on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni soldered joints

Abstract

References

Cited by

Periodical cited type(2)

Other cited types(3)

Catalog

Export File

Citation

Format

Content