Advanced Search
WU Jie, XUE Songbai, YU Zhihao, TAN Cheeleong, SUN Huabin, XU Yong. Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(7): 9-13. DOI: 10.12073/j.hjxb.20201211002
Citation: WU Jie, XUE Songbai, YU Zhihao, TAN Cheeleong, SUN Huabin, XU Yong. Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(7): 9-13. DOI: 10.12073/j.hjxb.20201211002

Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint

More Information
  • Received Date: December 10, 2020
  • Available Online: April 22, 2021
  • The change in shear force and evolution of interfacial microstructure of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint at the temperature 150 ℃ were investigated. The effect of rare earth Nd on the high temperature reliability of the solder joint and the corresponding enhanced mechanism were discussed. The results showed that the shear force of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint was significantly higher than that of Sn-3.8Ag-0.7Cu/Cu solder joint after different aging hours, and the decrease rate of shear force of Sn-3.8Ag-0.7Cu-0.05Nd/Cu solder joint was lower than that of the original solder joint during the aging process. This is because 0.05% Nd could reduce the interfacial diffusion coefficient from 1.88×10−10 cm2/h to 1.10×10−10 cm2/h, that is to say, the high temperature reliability of solder joints could be improved by inhibiting the coarsening of interfacial intermetallic compounds.
  • 姜楠, 张亮, 刘志权, 等. FCBGA器件SnAgCu焊点的热冲击可靠性分析[J]. 焊接学报, 2019, 40(9): 39 − 42.

    Jiang Nan, Zhang Liang, Liu Zhiquan, et al. Thermal shock reliability analysis of SnAgCu solder joints for FCBGA devices[J]. Transactions of the China Welding Institution, 2019, 40(9): 39 − 42.
    Samavatian V, Iman-Eini H, Avenas Y, et al. Effects of creep failure mechanisms on thermomechanical reliability of solder joints in power semiconductors[J]. IEEE Transactions on Power Electronics, 2020, 35(9): 8956 − 8964. doi: 10.1109/TPEL.2020.2973312
    孙凤莲, 李天慧, 韩帮耀. Sn5Sb1Cu0.1Ni0.1Ag/Cu(Ni)焊点的抗时效性能[J]. 焊接学报, 2020, 41(2): 28 − 32. doi: 10.12073/j.hjxb.20190929001

    Sun Fenglian, Li Tianhui, Han Bangyao. Aging resistance of Sn5Sb1Cu0.1Ni0.1Ag/Cu(Ni) solder joints[J]. Transactions of the China Welding Institution, 2020, 41(2): 28 − 32. doi: 10.12073/j.hjxb.20190929001
    Wang F, Ying H, Shuang T, et al. Effect of cooling and aging on microstructure and mechanical properties of Sn-9Zn solder[J]. China Welding, 2017, 26(1): 37 − 43.
    Annuar S, Mahmoodian R, Hamdi M, et al. Intermetallic compounds in 3D integrated circuits technology: a brief review[J]. Science and Technology of Advanced Materials, 2017, 18(1): 693 − 703. doi: 10.1080/14686996.2017.1364975
    Wu J, Xue S B, Wang J W, et al. Enhancement on the high-temperature joint reliability and corrosion resistance of Sn-0.3Ag-0.7Cu low-Ag solder contributed by Al2O3 nanoparticles (0.12%)[J]. Journal of Materials Science: Materials in Electronics, 2018, 29: 19663 − 19677. doi: 10.1007/s10854-018-0092-z
    张亮, Tu King Ning, 孙磊, 等. 纳米-微米颗粒增强复合钎料研究最新进展[J]. 中南大学学报(自然科学版), 2015, 46(1): 49 − 65. doi: 10.11817/j.issn.1672-7207.2015.01.008

    Zhang Liang, Tu King Ning, Sun Lei, et al. Latest research progress of nano micron particle reinforced composite solder[J]. Journal of Central South University (Natural Science Edition), 2015, 46(1): 49 − 65. doi: 10.11817/j.issn.1672-7207.2015.01.008
    刘霜, 薛松柏. Nd对Sn-0.7Cu-0.05Ni焊点组织与力学性能的影响[J]. 焊接学报, 2020, 41(1): 50 − 54.

    Liu Shuang, Xue Songbai. Effect of Nd on microstructure and mechanical properties of Sn-0.7Cu-0.05Ni solder joint[J]. Transactions of the China Welding Institution, 2020, 41(1): 50 − 54.
    Lau C S, Khor C Y, Soares D, et al. Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review[J]. Soldering & Surface Mount Technology, 2016, 28(2): 41 − 62.
    Tang Y, Li G Y, Chen D Q, et al. Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during isothermal aging process[J]. Journal of Materials Science: Materials in Electronics, 2014, 25(2): 981 − 991. doi: 10.1007/s10854-013-1675-3
    Fouzder T, Shafiq I, Chan Y C, et al. Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads[J]. Journal of Alloys and Compounds, 2011, 509(5): 1885 − 1892. doi: 10.1016/j.jallcom.2010.10.081
    Ding M, Xing W Q, Yu X Y, et al. Effect of micro alumina particles additions on the interfacial behavior and mechanical properties of Sn-9Zn-1Al2O3 nanoparticles on low temperature wetting and soldering of 6061 aluminum alloys[J]. Journal of Alloys and Compounds, 2017, 739: 481 − 488.
    Wu J, Xue S B, Wang J W, et al. Coupling effects of rare-earth Pr and Al2O3 nanoparticles on the microstructure and properties of Sn-0.3Ag-0.7 Cu low-Ag solder[J]. Journal of Alloys and Compounds, 2019, 784: 471 − 487. doi: 10.1016/j.jallcom.2019.01.034
    Sadiq M, Pesci R, Cherkaoui M. Impact of thermal aging on the microstructure evolution and mechanical properties of lanthanum-doped tin-silver-copper lead free solders[J]. Journal of Electronic Materials, 2013, 42: 492 − 501.
    Gao L L, Xue S B, Zhang L, et al. Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder[J]. Journal of Materials Science: Materials in Electronics, 2010, 21(7): 643 − 648. doi: 10.1007/s10854-009-9970-8
    Ye H, Xue S B, Pecht M. Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growth[J]. Materials Letters, 2013, 98(5): 78 − 81.
    Mansour M M, Saad G, Wahab L A, et al. Indentation creep behavior of thermally aged Sn-5wt%Sb-1.5wt%Ag solder integrated with ZnO nanoparticles[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(9): 1 − 10.
    马超力, 薛松柏, 李阳, 等. 时效对Sn-Cu-Ni-xPr/Cu焊点组织与性能的影响[J]. 焊接学报, 2014, 35(3): 85 − 88.

    Ma Chaoli, Xue Songbai, Li Yang, et al. Effect of aging on Microstructure and properties of Sn-Cu-Ni-xPr/Cu solder joints[J]. Transactions of the China Welding Institution, 2014, 35(3): 85 − 88.
  • Related Articles

    [1]LUO Yi, XIE Xiaojian, ZHU Yang, WAN Rui, HU Shaoqiu. Time and frequency domain analysis of metal droplet transfer by acoustic emission signals during pulse MIG welding of aluminum alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(4): 83-86,91.
    [2]ZHANG Xiaoli, LIN Fang, LI Yuzhen, XUE Jiaxiang. Analysis of arc adjustment mechanism to pulsed MIG welding based on PFM adjustment[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (12): 83-87.
    [3]ZHANG Xiaoli, LI Yuzhen, LONG Peng, XUE Jiaxiang. Pulsed MIG welding of aluminum alloy sheet based on fuzzy self-tuning PID control[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (11): 83-87.
    [4]YANG Lijun, LI Zhiyong, LI Huan, LI Junyue. Metal transfer under self-adapting control of meso-spray in pulse MIG welding of aluminum[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (8): 17-20.
    [5]PENG Haiyan, HUANG Shisheng, WU Kaiyuan, WANG Zhenmin. Digital control system based on DSP for pulsed MIG welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 63-66.
    [6]XUE Jiaxiang, YAO Ping, DONG Fei, WEN Yuanmei, WANG Zhenmin. Forward median waveform control process parameter in pulsed MIG welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (1): 73-76,80.
    [7]YANG Lijun, ZHANG Jian, LI Zhiyong, LI Junyue. A self-adapting control method of Al pulsed-MIG welding for meso-spray transfer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (4): 93-96.
    [8]WU Kai-yuan, HUANG Shi-sheng, MENG Yong-min, LI Yang. Control strategy of waveform with median phase in droplet transfer for pulsed MIG welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (4): 51-54,58.
    [9]LI He-qi, LI Chun-xu, LI Fang, LU Guang. Control optimization for pulsed MIG weding machine[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (4): 23-26.
    [10]Yin Shuyan, Gang Tie, Bu Huaquan. Microcumputer control system of synergic pulsed MIG welding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1991, (1): 46-52.
  • Cited by

    Periodical cited type(1)

    1. 朱明涛,孟云娜,凡亚丽,卢晨,侯雨珊,倪锋. 粉末烧结Cu-C-SnO_2多孔材料摩擦磨损特性研究. 粉末冶金工业. 2022(01): 36-44 .

    Other cited types(1)

Catalog

    Article views (407) PDF downloads (38) Cited by(2)

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return