PBGA solder joint fatigue under temperature cycling, random vibration and combined vibration and thermal cycling loading conditions

AN Tong; CHEN Xiaoxuan; QIN Fei; DAI Yanwei; GONG Yanpeng

doi:10.12073/j.hjxb.20190417001

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2021 > 42(9): 49-54. > DOI: 10.12073/j.hjxb.20190417001

AN Tong, CHEN Xiaoxuan, QIN Fei, DAI Yanwei, GONG Yanpeng. PBGA solder joint fatigue under temperature cycling, random vibration and combined vibration and thermal cycling loading conditions[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(9): 49-54. DOI: 10.12073/j.hjxb.20190417001

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PBGA solder joint fatigue under temperature cycling, random vibration and combined vibration and thermal cycling loading conditions

AN Tong^{1, 2,},
CHEN Xiaoxuan^{1, 2},
QIN Fei^{1, 2},
DAI Yanwei^{1, 2},
GONG Yanpeng^{1, 2}

1.
Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, 100124, China
2.
Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China

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Received Date: April 16, 2019
Available Online: December 01, 2021

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Abstract

Abstract

In this paper, temperature cycling, random vibration and combined loading tests were conducted on plastic ball grid array assemblies. The fatigue lives, the failure modes of the solder joints and the location of the failed solder joints for single loading and combined loading conditions were compared and analyzed. The results show much earlier solder joint failure for combined loading than that for either temperature cycling or pure vibration loading at room temperature. During temperature cycling and random vibration loading tests, the components at the central region have more failed solder joints than other components. The effect of the component location on the stresses and strains at the solder joints is not significant for combined loading. The primary failure mode is cracking within the bulk solder under temperature cycling, whereas the crack propagation path is along the intermetallic compound (IMC) layer for vibration loading. The solder joints subjected to combined loading exhibit both failure modes that occur for the temperature cycling and the vibration loading conditions.
- temperature cycling,
- random vibration,
- combined vibration and thermal cycling loading,
- failure mode,
- plastic ball grid array

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References (13)

References

崔海坡, 程恩清. 不同电子封装结构的随机振动分析[J]. 焊接学报, 2017, 38(7): 91 − 94. doi: 10.12073/j.hjxb.20150606002

Cui Haipo, Cheng Enqing. Random vibration analysis of different electronic packaging structures[J]. Transactions of the China Welding Institution, 2017, 38(7): 91 − 94. doi: 10.12073/j.hjxb.20150606002

黄春跃, 梁颖, 邵良滨, 等. 底充胶叠层PBGA 无铅焊点随机振动应力应变分析[J]. 焊接学报, 2015, 36(10): 33 − 36.

Huang Chunyue, Liang Ying, Shao Liangbin, et al. Stress and strain distribution of PBGA stacked lead-free solder joints with underfill with random vibration[J]. Transactions of the China Welding Institution, 2015, 36(10): 33 − 36.

林健, 雷永平, 吴中伟, 等. 板级焊点结构的热疲劳及机械疲劳性能分析[J]. 稀有金属材料与工程. 2013; 42: 1874-1878.

Lin Jian, Lei Yongping, Wu Zhongwei, et al. Thermal fatigue and mechanical fatigue behavior of board level solder joint[J]. Rare Metaliaterials and Engineering 2013, 42: 1874-1878.

Zhang B, Ding H, Sheng X J. Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact[J]. Microelectronics Reliability, 2009, 49: 530 − 536. doi: 10.1016/j.microrel.2009.02.024

Towashiraporn P, Gall K, Subbarayan G, et al. Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package[J]. International Journal of Fatigue, 2004, 26: 497 − 510. doi: 10.1016/j.ijfatigue.2003.09.004

Yang Q J, Wang Z P, Lim G H, et al. Reliability of PBGA assemblies under out-of-plane vibration excitations[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25: 293 − 300. doi: 10.1109/TCAPT.2002.1010020

Liu F, Meng G. Random vibration reliability of BGA lead-free solder joint[J]. Microelectronics Reliability, 2014, 54: 226 − 232. doi: 10.1016/j.microrel.2013.08.020

Wang H F, Zhao M, Guo Q. Vibration fatigue experiments of SMT solder joint[J]. Microelectronics Reliability, 2004, 44: 1143 − 1156. doi: 10.1016/j.microrel.2004.01.008

Xia J, Li G Y, Li B, et al. Fatigue life prediction of package-on-package stacking assembly under random vibration loading[J]. Microelectronics Reliability, 2017, 71: 111 − 118. doi: 10.1016/j.microrel.2017.03.005

Kim Y K, Lee S M, Hwang D S, et al. Analyses on the large size PBGA packaging reliability under random vibrations for space applications[J]. Microelectronics Reliability, 2020, 109: 113654. doi: 10.1016/j.microrel.2020.113654

Mattila T T, Li J, Kivilahti J K. On the effects of temperature on the drop reliability of electronic component[J]. Microelectronics Reliability, 2012, 52: 165 − 179. doi: 10.1016/j.microrel.2011.07.085

Pang J H L, Wong F L, Heng K T, et al. Combined vibration and thermal cycling fatigue analysis for SAC305 lead free solder assemblies[C]//Proceedings of 63rd Electronic Components and Technology Conference. Electronic Components and Technology Conference. Las Vegas, NV, United states, 2013, 1300 − 1307.

Zhang H W, Liu Y, Wang J, et al. Failure study of solder joints subjected to random vibration loading at different temperatures[J]. Journal of Materials Science:Materials in Electronics, 2015, 26(4): 2374 − 2379. doi: 10.1007/s10854-015-2693-0

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PBGA solder joint fatigue under temperature cycling, random vibration and combined vibration and thermal cycling loading conditions