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LIANG Xiaobo, LI Xiaoyan, YAO Peng, LI Yang. Microstructural evolution of Cu/Sn/Cu joints and effect of temperature on three-dimensional morphology of IMCs in packaging technology[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 49-54. DOI: 10.12073/j.hjxb.2018390223
Citation: LIANG Xiaobo, LI Xiaoyan, YAO Peng, LI Yang. Microstructural evolution of Cu/Sn/Cu joints and effect of temperature on three-dimensional morphology of IMCs in packaging technology[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 49-54. DOI: 10.12073/j.hjxb.2018390223
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Microstructural evolution of Cu/Sn/Cu joints and effect of temperature on three-dimensional morphology of IMCs in packaging technology

  • College of Materials Science and Engineering, Beijing university of technology, Beijing 100124, China

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  • Received Date: April 29, 2017
    Graphical Abstract
    • Abstract
  • A 4 μm thick Sn film was deposited on the copper substrate by electroplating. Two copper substrates with electroplated Sn were constituted of a Cu/Sn/Cu structure. 240℃ and 1 N were chosen as soldering temperature and pressure to be soldered for different time to investigate the law of microstructural evolution of IMCs. The three-dimensional morphology of Cu6Sn5 and Cu3Sn under different soldering temperature(240, 270, 300℃) were fabricated, Investigate the effect of temperature on three-dimensional morphology. The results show Cu6Sn5 was planar after soldered for 30 min and turned into scallop-like with the increase of soldering time. Cu3Sn in the bottom of scallop was thicker than that in bottom of scallop on both sides. Sn was reacted with the increase of soldering time, Cu6Sn5 in the two side merged into a whole gradually. Increase more soldering time, Cu6Sn5 continued to be transformed into Cu3Sn. The three-dimensional of Cu6Sn5 transformed from polyhedron shape to procumbent and the size of Cu3Sn grains decreased gradually with the increase of soldering temperature.
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    • References (14)
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