Influence of process parameters on microstructure and properties of IC10 single crystal TLP joints

IC10 single crystal superalloy was TLP bonded at 1 240℃ using nickel base amorphous foils, KNi3A. Microstructures of joints bonded with different parameters were studied using scanning electron microscopy. High temperature tensile test and creep rupture property test were performed. Results revealed that, joints with 0.04 mm gap bonded at 1 240℃ for 10 hours share similar microstructure with base metal and have excellent mechanical properties. When it comes to joints with 0.04 mm gap bonded for 6 hours or joints with 0.08 mm gap bonded for 10 hours, there were eutectics and compounds in the joints and the property weaken sharply due to a not completed isothermal solidification.