Advanced Search
JIANG Xunyan, CHEN Yiping, WANG Ming, CHENG Donghai. Investigation on microstructural homogeneity in laser beam welding joint superplastic deformation[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(8): 28-32. DOI: 10.12073/j.hjxb.20150904002
Citation: JIANG Xunyan, CHEN Yiping, WANG Ming, CHENG Donghai. Investigation on microstructural homogeneity in laser beam welding joint superplastic deformation[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(8): 28-32. DOI: 10.12073/j.hjxb.20150904002

Investigation on microstructural homogeneity in laser beam welding joint superplastic deformation

More Information
  • Received Date: September 03, 2015
  • In this paper, TC4 alloy is welded by laser beam welding. Through the technology of hydrogenation treatment to analyze the structural homogeneity of the welding joint superplastic deformation .The effect of different hydrogen content on the deformation uniformity and deformation uniformity of TC4 titanium alloy laser welding joint was studied. The coefficient structural inhomogeneity of deformation is adopted to express the microstructural homogeneity. The test shows that with the technology of hydrogenation treatment, the phase composition is able to be adjusted and the homogeneity of the welding joint superplastic deformation is able to improved. With increasing hydrogen content, the coefficient structural homogeneity is decreased and the structural becomes more evenly. With the same hydrogen content, the decrease deformation temperature and the reduce initial strain rate both can improve the level of structural homogeneity. With the hydrogen content(1.30% H), the deformation temperature(920 ℃), and the initial strain rate(1×10-4 s-1), the coefficient microstructural homogeneity runs up to 95%.
  • 程东海, 黄继华, 杨 静, 等. TC4钛合金激光焊接接头超塑性变形力学行为研究[J]. 稀有金属材料与工程, 2010, 39(2): 277-280. Cheng Donghai, Huang Jihua, Yang Jing,etal. Superplastic deformation mechanical behavior of laser welded joints of TC4 titanium alloys[J]. Rard Metalmaterials and Engineering, 2010, 39(2): 277-280.[2] 程东海, 陈益平, 胡德安, 等. TC4钛合金激光焊对接接头超塑变形显微组织[J]. 焊接学报, 2011, 32(9): 81-84. Cheng Donghai, Chen Yiping, Hu Dean,etal. Microstrucutre analysis of superplastic deformation on laser butt weld Ti-6Al-4V joint[J]. Transations of the China Welding Institution, 2011, 32(9): 81-84.[3] 程东海, 黄继华, 陈益平, 等. 激光焊接头超塑变形组织表征[J]. 焊接学报, 2012, 33(7): 89-92. Cheng Donghai, Huang Jihua, Chen Yiping,etal. Microstructure evolution characterization of superplastic deformation of titanium alloy[J]. Transations of the China Welding Institution. 2012, 33(7): 89-92.[4] 郭 隆, 白秉哲, 侯红亮. 置氢Ti-6Al-4V钛合金超塑性研究[J]. 稀有金属, 2009, 33(4): 467-471. Guo Long, Bai Bingzhe, Hou Hongliang.Superplasticity of Ti-6Al-4V alloy processed by hydrogenation[J]. Chinese Journal of RaremetlasI, 2009, 33(4): 467-471.[5] 姚 伟, 巩水利. 激光焊接对SPF/DBTi-6Al-4V合金疲劳性能的影响[J]. 焊接学报, 2009, 30(2): 149-152. Yao Wei, Gong Shuili. Influences of laser welding on fatigue propertis of SPF/DB Ti-6A1-4V alloy laser welding[J]. Transations of the China Welding Institution. 2009, 30(2): 149-152.
  • Related Articles

    [1]LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001
    [2]YANG Dongsheng, ZHANG He, FENG Jiayun, SA Zicheng, WANG Chenxi, TIAN Yanhong. Research progress on micro/nano joining technologies and failure behaviors in electronic packaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 126-136. DOI: 10.12073/j.hjxb.20220702003
    [3]SUN Lei, ZHANG Yi, CHEN Minghe, ZHANG Liang, MIAO Naiming. Finite element analysis of solder joint reliability of 3D packaging chip[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(1): 49-53. DOI: 10.12073/j.hjxb.20201021002
    [4]YANG Hong, LI Yulong, DONG Yangping, CUI Qingbo. Ultrasonic welding packaging of FBG and its bending sensing characteristics[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(8): 69-75. DOI: 10.12073/j.hjxb.2019400211
    [5]HAN Lishuai, HUANG Chunyue, LIANG Ying, KUANG Bing, HUANG Genxin. Analysis of stress strain and shape size optimization of 3D micro-scale CSP solder joints in random vibration[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 64-70. DOI: 10.12073/j.hjxb.2019400156
    [6]XIONG Mingyue1, ZHANG Liang1,2, LIU Zhiquan2, YANG Fan1, ZHONG Sujuan3, MA Jia3, BAO Li3. Structure optimization design of CSP device based on Taguchi method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(5): 51-54. DOI: 10.12073/j.hjxb.2018390121
    [7]CUI Haipo, CHENG Enqing. Random vibration analysis of different electronic packaging structures[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(7): 91-94. DOI: 10.12073/j.hjxb.20150606002
    [8]NAN Qiuming, WU Haoying, LI Sheng. Metallization packaging method for FBG vibration sensor[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(2): 17-20.
    [9]WANG Bo, MO Liping, WU Fengshun, XIA Weisheng, WU Yiping. Microstructure of solder joints with micron stand-off height in electronic packaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 25-28.
    [10]YE Huan, XUE Songbai, ZHANG Liang, WANG Hui. Finite element analysis on reliability of lead-free soldered joints for CSP device[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 93-96.
  • Cited by

    Periodical cited type(1)

    1. 蒋宝,徐富家,杨义成,聂鑫,宋扬,刘孔丰. 万瓦级激光-电弧复合穿透焊接成形缺陷研究. 电焊机. 2022(10): 15-22 .

    Other cited types(1)

Catalog

    Article views (895) PDF downloads (486) Cited by(2)

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return