Study on real-time imaging detection of bonding defects by acoustic impedance method

CHI Dazhao; GUO Tao; ZHANG Runqi; ZHANG Tao; SHEN Hao

doi:10.12073/j.hjxb.20220702001

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2022 > 43(11): 107-111. > DOI: 10.12073/j.hjxb.20220702001

CHI Dazhao, GUO Tao, ZHANG Runqi, ZHANG Tao, SHEN Hao. Study on real-time imaging detection of bonding defects by acoustic impedance method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001

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Study on real-time imaging detection of bonding defects by acoustic impedance method

1.
Harbin Institute of Technology, State Key Laboratory of Advanced Welding and Joining, Harbin 150001
2.
National Innovation Center of High Speed Train, Qingdao 266000

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Received Date: July 01, 2022
Available Online: October 13, 2022

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Abstract

Abstract

In order to detect the bonded structure defects effectively, an imaging inspection system based on acoustic impedance method is constructed. The system includes three parts: acoustic signal acquisition, acoustic probe positioning, data processing and imaging. Probe positions during dynamic scanning are collected using two rotary encoders. The defect data are collected using a Bonding Quality Detector. The data processing and image drawing programs are written in C++ language. The bonded sandwich structure of aluminum alloy/epoxy resin/aluminum alloy was tested using both acoustic impedance and conventional ultrasonic C-scan imaging methods, and the test results were compared and analyzed. The results show that the acoustic impedance based imaging method can identify defects in bonded structures more effectively, and single-sided testing can meet the needs of defect detection.
- Non-destructive testing,
- bonded structure,
- defect detection,
- acoustic impedance method

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