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XU Xiangping, WANG Hong, ZOU Jiasheng, XIA Chunzhi. Interfacial structure and properties of Si3N4 ceramic and TiAl alloys brazed with Ti/Ag-Cu/Cu interlayers[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(12): 91-94.
Citation: XU Xiangping, WANG Hong, ZOU Jiasheng, XIA Chunzhi. Interfacial structure and properties of Si3N4 ceramic and TiAl alloys brazed with Ti/Ag-Cu/Cu interlayers[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(12): 91-94.

Interfacial structure and properties of Si3N4 ceramic and TiAl alloys brazed with Ti/Ag-Cu/Cu interlayers

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  • Received Date: December 07, 2014
  • The Si3N4 ceramics was brazed to TiAl alloys with Ti/Ag-Cu/Cu as the interlays, and a good joint was obtained. The interfacial microstructure of the joint and the elements were analyzed by scanning electron microscope (SEM) and energy dispersive spectrometer distribution (EDS). The results show that the typical interfacial microstructure of Si3N4/Ti/Ag-Cu/Cu/TiAl may be Si3N4/TiN/Ti-Si/Cu-Ti+Ag(s,s)+Cu(s,s)/AlCuTi/TiAl. The influences of brazing temperature, holding time and the pressure of the joint on the four-point bending strength of the joint were researched by using controlling variables method. The four-point bending strength of the joint reaches the maximum of 170 MPa when the brazing temperature, holding time and the pressure of the joint are 1 133 K, 30 min and 0.040 MPa, respectively.
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