Advanced Search
CHEN Long, CHENG Donghai, CHEN Yiping, HU Dean. Superplastic deformation behavior of electron beam welded 5A90 aluminum lithium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(9): 75-78.
Citation: CHEN Long, CHENG Donghai, CHEN Yiping, HU Dean. Superplastic deformation behavior of electron beam welded 5A90 aluminum lithium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(9): 75-78.

Superplastic deformation behavior of electron beam welded 5A90 aluminum lithium alloy

More Information
  • Received Date: October 21, 2014
  • The superplastic deformation behavior of electron beam welded joints of 5A90 aluminum lithium alloys was researched by high temperature tensile test. The results indicated that the electron beam welded joints of 5A90 aluminum lithium alloys present good superplasticity. The peak flow stress decreased while the temperature increased or the initial strain rate decreased, and the flow stress was below 32 MPa while the initial strain rate was below 1×102/s. The elongation of joints increased first and then decreased with increase of the deformation temperature and initial strain rate, and the maximal elongation of 171.1% was obtained at the optimal parameter 450℃, 5×103/s. Deformation coefficient K was introduced to characterize the superplasticity of electron beam weld joints. The K values were beyond 70% at all deformation parameters.
  • 尹登峰, 郑子樵. 铝锂合金研究开发的历史与现状[J]. 材料导报, 2003, 17(2): 18-20. Yin Dengfeng, Zheng Ziqiao. History and current status of aluminum-lithium alloys research and development[J]. Materials Review, 2003, 17(2): 18-20.
    程东海, 黄继华, 陈益平, 等. 激光焊接头超塑变形组织表征[J]. 焊接学报, 2012, 33(7): 89-92. Cheng Donghai, Huang Jihua, Chen Yiping, et al. Microstructure evolution characterization of superplastic deformation of titanium alloy[J]. Transactions of the China Welding Institution, 2012, 33(7): 89-92.
    Ma Z Y, Mishra R S, Mahoney M W. Superplastic deformation behaviour of friction stir processed 7075Al alloy[J]. Acta Materialia, 2002, 50(17): 4419-4430.
    Han Wenbo, Zhang Kaifeng, Wang Guofeng. Superplastic forming and diffusion bonding for honeycomb structure of Ti-6Al-4V alloy[J]. Journal of Materials Processing Technology, 2007, 183(2-3): 450-454.
    王长文, 张凯锋. Al-Li 2091合金超塑成形/扩散连接工艺研究[J]. 塑性工程学报, 1998, 5(4): 1-6. Wang Changwen, Zhang Kaifeng. Study of SPF/DB technology of Al-Li alloy[J]. Journal of Plasticity Engineering,1998, 5(4): 1-6.
    翟熙伟, 陈芙蓉, 毕良艳, 等. 7A52铝合金电子束焊接参数及性能[J]. 焊接学报, 2012, 33(8): 73-76. Zhai Xiwei, Chen Furong, Bi Liangyan, et al. Welding parameters and mechanical properties of electron beam welding of 7A52 aluminum alloy[J]. Transactions of the China Welding Institution, 2012, 33(8): 73-76.
    Huang J C, Shen Y D, Hao N J. Characterization of electron beam welding of superplastic 8090 Al-Li alloys[J]. Materials Science and Technology, 1994, 10(6): 647-657.
  • Related Articles

    [1]WANG Xiaowei, WANG Fengjiang. Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 70-74, 81. DOI: 10.12073/j.hjxb.20230613008
    [2]YANG Weiran, JI Tongtong, DING Yu, WANG Fengjiang. Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 157-162. DOI: 10.12073/j.hjxb.20220709003
    [3]QIU Xiliang, HAO Chengli, XIU Ziyang, HUANG Yilong, WU Gaohui, HE Peng. Preparation and properties of Y2O3/Sn-58Bi composite solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(1): 91-94.
    [4]XING Fei, QIU Xiaoming, ZHANG Hongqiang, YIN Shanwen. Microstructure and properties of Zn-Cu-Sn-Bi high-temperature solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 77-80,108.
    [5]CHEN Zhihao, ZHENG Wei, ZHU Xiebin, ZU Fangqiu. Effects of Sn-Bi-Cu alloy melt structure change on solidification[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (10): 61-64.
    [6]HE Hongwen, XU Guangchen, GUO Fu. Mechanism investigation of Bi layer formation at anode interface in Cu/Sn-58Bi/Cu solder joint induced by electromigration[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (10): 35-38,42.
    [7]ZHOU Jian, FU Xiaoqing, SUN Yangshan, DING Kejian. Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 45-48.
    [8]SUN Fenglian, HU Wengang, WANG Lifeng, MA Xin. Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (10): 5-8.
    [9]WANG Lifeng, SUN Fenglian, LIU Xiaojing, LIANG Ying. Design of Sn-Ag-Cu-Bi solder alloy and analysis on microstructure and properties[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 9-12.
    [10]Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23.
  • Cited by

    Periodical cited type(1)

    1. 孙磊,王文昊,王静,虞佳鑫,张亮,姜加伟. 等温时效对Cu-Sn IMC焊点的组织与性能影响. 焊接学报. 2025(03): 82-88 . 本站查看

    Other cited types(0)

Catalog

    Article views (416) PDF downloads (222) Cited by(1)

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return