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CHEN Bo, WU Shibiao, XIONG Huaping, LI Wenwen. Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing filler[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(4): 47-51.
Citation: CHEN Bo, WU Shibiao, XIONG Huaping, LI Wenwen. Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing filler[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(4): 47-51.

Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing filler

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  • Received Date: January 11, 2015
  • A novel Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti active filler alloy was designed for joining of SiO2f/SiO2 composite to Nb at 780℃ for 20 min, 780℃ for 40 min and 800℃ for 10 min, respectively. The joints brazed with the filler alloy at 800℃ for 10 min presented the maximum average shear strength of 21.6 MPa. During the brazing process, the active element Ti diffused significantly from the Ag-Cu-In-Ti alloy to the surface of the SiO2f/SiO2 composite and a thin reaction layer with a thickness of 2 μm was formed close to the composite. Sound interface was also obtained between the filler alloy and Nb. The interface structure of the joint brazed with Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti alloy can be described as the following sequence:SiO2f/SiO2→TiO+TiSi2→TiO+Cu3Ti→Ag(s, s)+Ag3In+Cu(s,s)→Nb.
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