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HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
Citation: HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
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Study on stress distribution of 3D-TSV interconnect structure under random vibration load

  • 1.

    School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

  • 2.

    Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China

  • 3.

    Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China

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  • Received Date: February 13, 2014
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    • Abstract
  • The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS, the finite element analysis of the stress distribution in the model was performed under the condition of thermal-structure coupling. The TSV height and the TSV diameter, the micro-bump height and the micro-bump diameter were selected as four key configuration parameters, combinations were designed. By using an L16(45) orthogonal array the 3D-TSV which have 16 different configuration parameters' levels. The maximum stress values within 3D-TSV were obtained. Variance analysis was performed based on the values of stress. The results show that the TSV height has highly significant impact on the stress of 3D-TSV under random vibration with 99% confidence. The TSV height, the TSV diameter, the micro-bump diameter and the micro-bump height affect the stress of 3D-TSV in a descending order. The single-factor analysis of variance shows that the stress and strain in TSV interconnect structure increase with the height of TSV.
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    • References (8)
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