Citation: | TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Interfacial IMC evolution in micron Sn-Ag-Cu soldered joint during thermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (11): 101-104. |
[1] | YAO Zongxiang, LIU Yikai, ZHOU Yang, WANG Gang, YIN Limeng, LI Hongju, CAI Jiao. Interfacial reaction at Cu-core heterogenous solder joints and its effects on mechanical properties during isothermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(3): 51-58. DOI: 10.12073/j.hjxb.20231205003 |
[2] | WANG Xiaowei, WANG Fengjiang. Size effect behavior of microstructure and mechanical properties in Sn-58Bi micro solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 70-74, 81. DOI: 10.12073/j.hjxb.20230613008 |
[3] | YANG Weiran, JI Tongtong, DING Yu, WANG Fengjiang. Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 157-162. DOI: 10.12073/j.hjxb.20220709003 |
[4] | TIAN Ye. Study on reliability of micro-solder joints for flip chip assemblies under thermal shock-crack growth mechanism[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(9): 43-45,50. |
[5] | MA Chaoli, XUE Songbai, LI Yang, XU Yiwei, JIANG Junyi. Effect of thermal aging on intermetallic compounds and properties of Sn-Cu-Ni-xPr/Cu soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(3): 85-88. |
[6] | TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104. |
[7] | ZHANG Liang, TU K N, GUO Yonghuan, HE Chengwen, ZHANG Jian. Effect of aging on the interface and properties of SnAgCu/SnAgCu-TiO2 solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (8): 43-46. |
[8] | JI Feng, XUE Songbai, ZHANG Man, LOW Jiyuan, WANG Shuiqing. Effects of thermal aging on intermetallic compounds and properties of Cu/Al brazing joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (5): 21-24. |
[9] | YU Chun, XIAO Junyan, LU Hao. Effects of 1.0% Zn or Ni additions on interfacial reaction and growth of intermetallics in Sn-3.5Ag Cu joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 81-83. |
[10] | ZHANG Chao, LU Qinghua, XU Jijin, CHEN Ligong. Comparison of stress relief by PWHT and VSR in large-dimension straight welded pipe[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (10): 97-100. |