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TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Interfacial IMC evolution in micron Sn-Ag-Cu soldered joint during thermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (11): 101-104.
Citation: TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Interfacial IMC evolution in micron Sn-Ag-Cu soldered joint during thermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (11): 101-104.

Interfacial IMC evolution in micron Sn-Ag-Cu soldered joint during thermal aging

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  • Received Date: December 28, 2012
  • The interfacial intermetallic compound(IMC) evolution in micro-soldered joints in thermal aging process of flipchip assemblies was investigated.The results show that all (Ni, Cu)3Sn4 on the Ni pad interface are transformed into (Cu, Ni)6Sn5 after 300 h for thermal aging due to the effect of Cu atoms diffused from the Cu pad interface on the (Ni,Cu)3Sn4.On the Cu pad interface,a thin layer of Cu3Sn forms on the interface between the Cu pad and (Cu,Ni)6Sn5 after 100 h for aging, however in the subsequent thermal aging,Cu3Sn experiences little growth because of the limitation effect of Ni on its growth.The growth rate of (Cu,Ni)6Sn5 on the both pad interfaces are fast before 100 h,and after 100 h,it become slower and slower.Furthermore,as the aging time increases,the interface of (Cu, Ni)6Sn5 grain inclines to be flat.
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