Advanced Search
TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.
Citation: TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.
shu

Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

  • 1.

    Henan University of Technology, School of Mechanical and Electrical Engineering, Zhengzhou 450000, China;School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

  • 2.

    School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

  • 3.

    Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China

More Information
  • Received Date: July 19, 2012
    Graphical Abstract
    • Abstract
  • Through the cyclic load-unload test of nano-indentation method,the effects of maximum load on cycling mechanics behavior for two kinds micro-solder joints of Sn-3.0Ag- 0.5Cu/Cu and Sn-0.3Ag-0.7Cu/Cu were investigated.The results indicated that the cycling F-h curves that before closed showed a hysteresis loop.The area of hysteresis loop and indentation residual depth of micro-soldered joints increased with the increase of the maximum load.The cumulative damage of microsoldered joints increased.When the maximum load was given, the area of hysteresis loop and increments of residual indentation depth decreased gradually with the loading time increasing.Indentation creep C of micro-soldered joints decreased with the increase of the maximum load.At the same time,indentation creep C of micro-soldered joints sharply decreased at first and then plateaued with the loading time increasing.Indentation creep C of Sn-3.0Ag-0.5Cu/Cu micro-soldered joint was less than that of Sn-0.3Ag-0.7Cu/Cu micro-soldered joint.
    • FullText(HTML)
    • References (0)
    • Related Articles

  • Related Articles

    [1]WU Yang, ZHANG Zhijie, LIANG Wangrong, CHEN Leida. Interfacial Reaction and Shear Properties of Laser-Soldered Sn3.0Ag0.5Cu/Ni-P Microbumps[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240628001
    [2]YAO Zongxiang, LIU Yikai, ZHOU Yang, WANG Gang, YIN Limeng, LI Hongju, CAI Jiao. Interfacial reaction at Cu-core heterogenous solder joints and its effects on mechanical properties during isothermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(3): 51-58. DOI: 10.12073/j.hjxb.20231205003
    [3]LI Wenwen<sup>1</sup>, XIONG Huaping<sup>1</sup>, CHEN Bo<sup>1</sup>, ZOU Wenjiang<sup>1</sup>, LIU Wei<sup>2</sup>. Microstructure and mechanical property of Cf/SiBCN composite joint brazed with Cu-Pd-V filler alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(9): 90-94. DOI: 10.12073/j.hjxb.2018390230
    [4]ZHANG Qingke, ZHONG Sujuan, ZHANG Lei, LONG Weimin, WANG Dezhi. Investigation on interfacial reaction behavior of brazed joint of austenitic stainless steel/Cu filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(3): 75-78.
    [5]TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Interfacial IMC evolution in micron Sn-Ag-Cu soldered joint during thermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (11): 101-104.
    [6]LUO Jiadong, XUE Songbai, YE Huan, YANG Jingqiu. Interfacial microstructure and properties of SnCuNi-xPr/Cu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (5): 49-52.
    [7]YANG Weihua, LI Jinglong, XIONG Jiangtao, ZHANG Fusheng, L&#220; Xuechao. Morphological analysis of interfacial reaction layers in Mo foil and Al foil jointing by diffusion bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 41-45.
    [8]YU Chun, XIAO Junyan, LU Hao. Effects of 1.0% Zn or Ni additions on interfacial reaction and growth of intermetallics in Sn-3.5Ag Cu joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 81-83.
    [9]WEI Guoqiang, KUANG Min, YANG Yongqiang. Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-reinforced composite solder Sn-9Zn[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (5): 105-108.
    [10]LIU Jun-hong, SUN Kang-ning, GONG Hong-yu, TAN Xun-yan. Interfacial microstructure of Al2O3-based ceramic composite/steel joint by brazing in air[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (6): 26-28.

  • Cited by

    Periodical cited type(10)

    1. 赵新成，杨军，赵泳林，李函，韩冰源. 焊接过程中热输入对铝合金焊接质量的影响及其控制. 江苏理工学院学报. 2025(01): 87-98 .
    2. 林茜，许敏，朱雯静，李文强，姚屏，梁道赞. 工业机器人铝合金双脉冲MIG焊工艺参数匹配对焊缝的影响. 自动化与信息工程. 2023(04): 33-40+45 .
    3. 宋刚，刘振夫，程继文，刘黎明. 6061-T6铝合金激光诱导电弧焊轧复合成形组织性能. 航空学报. 2022(02): 195-202 .
    4. 范越. 手工焊焊接速度在线检测技术研究. 电焊机. 2022(09): 81-85+112 .
    5. 陈鑫，杨立飞，王佳宁，张冠宸，司徒德蓉. 6061-T6铝合金薄板双脉冲MIG焊动态组合热源模型. 湖南大学学报(自然科学版). 2022(12): 83-91 .
    6. 戴丽芳，孔华，孙禄帅，巩全军. 轨道交通用6082-T6铝合金MIG焊接接头组织与疲劳性能. 内燃机与配件. 2020(20): 76-77 .
    7. 龚淼，戴士杰，王志平，王立文. 航空压气机叶片增材修复最优热输入分析. 焊接学报. 2020(08): 39-47+99 . 本站查看
    8. 陈琪昊，崔山成，林三宝，高翔，张澳. 超声频脉冲电信号耦合前后铝合金TIG堆焊接头特点. 焊接学报. 2020(10): 42-46+99-100 . 本站查看
    9. 黄绍服，曹鑫，茅卫东，李盛良，李君. 热输入对铝合金双脉冲MIG焊气孔缺陷的影响. 安徽理工大学学报(自然科学版). 2020(05): 8-12 .
    10. 董晓晶，李桓，杨立军，梁裕. 铝合金多股复合焊丝脉冲MIG焊接接头组织与性能分析. 焊接学报. 2019(11): 61-67+163-164 . 本站查看

    Other cited types(16)

Catalog

    Get Citation
    PDF
    XML
    Article views (242) PDF downloads (106) Cited by(26)
    Turn off MathJax
    Article Contents
    Abstract
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return