Citation: | WANG Ke, ZHENG Zhentai, XUE Haitao, SONG Hongwei. Microstructure of 254SMO/Q235B dissimilar steel welded joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (2): 105-108. |
TG422
|
[1] | YIN Yan, KANG Ping, LU Chao, ZHANG Yuan, ZHANG Ruihua. Microstructure and microhardness analysis of laser welded dissimilar steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(7): 71-77. DOI: 10.12073/j.hjxb.20191227002 |
[2] | WANG Haiyan, NIU Chunju, CUI Guotao, ZHAI Haizhou. Study of microstructure and properties of TP304/SS400 dissimilar welding joints under three processes[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(5): 131-136. DOI: 10.12073/j.hjxb.2019400140 |
[3] | CHEN Yiping, SHAO Jinghui, HU Dean, CHENG Donghai. Analysis of microstructure and mechanical properties of dissimilar metal spot welded joint between magnesium alloy and steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (4): 101-104. |
[4] | HU Jie, JIANG Zhizhong, HUANG Jihua, CHEN Shuhai, ZHAO Xingke, ZHANG Hua. Effects of heat treatment processes on microstructure and impact toughness of weld metal of vacuum electron beam welding on CLAM steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (11): 67-71. |
[5] | JIANG Zhizhong, HUANG Jihua, HU Jie, CHEN Shuhai. Microstructure and mechanical properties of laser welded joints of CLAM steel used for fusion reactor[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (2): 5-8. |
[6] | WANG Jianxin, YIN Ming, LAI Zhongmin, LI Xue. Wettability and microstructure of Sn-Ag-Cu-In solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (11): 69-72. |
[7] | MA Chong, JING Hongyang, XU Lianyong, XU Delu, CHEN Yucheng. Microstructure investigation on Type Ⅳ cracking in P92 steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (8): 49-52. |
[8] | XING Li, LI Lei, KE Liming. Microstructural investigation on friction stir welds of dissimilar metals between mild steel and copper[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (2): 17-20. |
[9] | TIAN Jun, HAO Hu, SHI Yao-wu, XIA Zhi-dong. Microstructure of lead-free solder for a SnAgCuEr system[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (9): 31-34. |
[10] | LIU Peng, LI Ya-jiang, WANG Juan, GENG Hao-ran. Microstructure in interface zone of diffusion-bonded joint of Mg/Al dissimilar materials[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (5): 5-8. |