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YANG Yang, LU Hao, YU Chun, CHEN Junmei, CHEN Zhenying. Effect of Zn on formation of voids on SnxZn/Cu interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 53-56.
Citation: YANG Yang, LU Hao, YU Chun, CHEN Junmei, CHEN Zhenying. Effect of Zn on formation of voids on SnxZn/Cu interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 53-56.
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Effect of Zn on formation of voids on SnxZn/Cu interface

  • 1.

    School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai 200240, China

  • 2.

    School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai 200240, China;Key Laboratory of Shanghai Laser Manufacturing and Materials Modification, Shanghai Jiaotong University, Shanghai 200240, China

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  • Received Date: November 21, 2011
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    • Abstract
  • The effect of Zn on formation of Kirkendall voids on the interface was studied through the reaction between SnxZn solders (x = 0,0.2%,0.5%,0.8%) and the electroplated Cu substrate. During the thermal aging of Sn/Cu joints,a number of Kirkendall voids were formed in the Cu3Sn layer and on the Cu3Sn/EPC interface. With the increase of Zn content in solder,the growth of Cu3Sn layer was greatly suppressed,and the formation of Kirkendall voids was effectively inhibited. The concentration of Zn on the reaction interface also significantly increased. Zn participated in the interface reaction, (Cu,Zn)6Sn5,Cu6(Sn,Zn)5 and Cu-Zn solid-solution alloy were formed,among which the Cu-Zn solid-solution alloy layer can greatly affect the diffusion of Cu. Zn served as a diffusing element during the interface reaction,which can improve the unbalanced diffusion of Cu and Sn to a great degree,and suppress the formation of voids effectively.
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