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QIN Fei, AN Tong, ZHONG Weixu, LIU Chengyan. Nanoindentation properties of intermetallic compounds in lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 25-28,32.
Citation: QIN Fei, AN Tong, ZHONG Weixu, LIU Chengyan. Nanoindentation properties of intermetallic compounds in lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 25-28,32.

Nanoindentation properties of intermetallic compounds in lead-free solder joints

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  • Received Date: November 29, 2012
  • The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface was investigated under isothermal aging temperature of 150℃ and aging time of 100,300, 500 and 1 000 h,respectively. The relationship between the thickness of the IMCs layer and aging time was fitted out,and the growth law of the IMCs layer at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition was obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn were obtained by a nanoindentation tester. It indicates that with the Cu6Sn5 thickness increasing, its Young's modulus and hardness have no significant change. The Young's modulus of Cu3Sn is greater than that of Cu6Sn5,but the hardness of Cu3Sn is lower than that of Cu6Sn5. The nanoindentation experiments of the Sn3.0Ag0.5Cu/Cu interfacial zone show that the hardness of Cu,Cu3Sn,Cu6Sn5 and Sn3.0Ag0.5Cu has an order of magnitude that is in sequence Cu6Sn5 > Cu3Sn > Cu > Sn3.0Ag0.5Cu.
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