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SHI Yiping, XUE Songbai, WANG Jianxin, GU Liyong, GU Wenhua. Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (11): 73-77.
Citation: SHI Yiping, XUE Songbai, WANG Jianxin, GU Liyong, GU Wenhua. Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (11): 73-77.

Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints

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  • Received Date: August 09, 2007
  • Effects of rare earth Ce on spreadability of Sn-Cu-Ni solder on copper, mechanical properties of soldered joints and the microstructure of Sn-Cu-Ni-Ce solder were investigated respectively.The results indicate that with the increase of the content of Ce added to the Sn-Cu-Ni solder, the spreading area of Sn-Cu-Ni-Ce solder on copper was enlarged.When the content of Ce is about 0.05%, the spreading area is the largest and the microstructure of Sn-Cu-Ni solder is fine and uniform, and the mechanical properties of soldered joints are improved observably.Experimental results also show when the content of Ce is over 0.05%, the grains of the solder gradually become coarse, the spreadability of the solder descend, and the mechanical properties of soldered joints deteriorate as well.

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