Citation: | TIAN Jun, HAO Hu, SHI Yao-wu, XIA Zhi-dong. Microstructure of lead-free solder for a SnAgCuEr system[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (9): 31-34. |
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[2] | XUE Peng, WANG Kehong, ZHOU Qi, HE Peng, LONG Weimin, ZHONG Sujuan. Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(1): 33-36. |
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[4] | YANG Sijia, YANG Xiaohua. Microstructure and mechanical properties of SnAgCu/Cu solder joint during isothermal aging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (5): 83-86. |
[5] | HU Yuhua, XUE Songbai, Yang Jingqiu, YE Huan, GU Liyong, GU Wenhua. Effects of aging treatment on reliability of SnZn soldered joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (3): 41-44. |
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[7] | LI Xinmei, ZOU Yong, ZOU Zengda, ZHANG Zhongwen. Aging embrittlement of Super 304H steel welded joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (2): 1-4,24. |
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[10] | CHEN Yan, XUE Song-bai, LV Xiao-chun, LIAO Yong-ping. Influence of cerium on microstructure of Sn-Ag-Cu lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (12): 69-72. |
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