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YAO Li-hua, XUE Song-bai, WANG Peng, LIU Lin. Effect of diode-laser parameters on tensile strength of QFP micro-joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 90-92.
Citation: YAO Li-hua, XUE Song-bai, WANG Peng, LIU Lin. Effect of diode-laser parameters on tensile strength of QFP micro-joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 90-92.

Effect of diode-laser parameters on tensile strength of QFP micro-joints

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  • Received Date: July 28, 2005
  • Soldering technology for quad flat pack devices(QFP) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power.Results indicate that diode-laser soldering can obviously improve both the tensile strength of the joints with Sn-Ag-Cu solder and the strength of the joints with Sn-Pb solder.The diodelaser output power directly influences the tensile strength of the micro-joints of QFP with the same solders.These results will provide a good method for improving the strength and reliability of fine pitch QFP devices.
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