Citation: | ZOU Jia-sheng, XU Zhi-rong, ZHAO Qi-zhang, CHEN Zheng. Bonding strength of double partial transient liquid phase bonding with Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (2): 41-44. |
[1] | ZOU Jiasheng, ZENG Peng, XU Xiangping. Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (11): 47-50. |
[2] | HE Peng, YANG Xiujuan, FENG Jicai, LIU Hong. Effects of holding time on interface structure and bonding strength of brazed joint of hydrogenated TC4 titanium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (2): 1-4. |
[3] | ZOU Jiasheng, ZHAO Hongquan, JIANG Zhiguo. Microstructure and strength of Si3N4 joint brazed with Ti40Zr25Ni15Cu20 amorphous brazing alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (3): 45-48. |
[4] | WANG Fu-liang, LI Jun-hui, HAN Lei, ZHONG Jue. Effect of bonding time on thick aluminum wire wedge bonding strength[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (5): 47-51. |
[5] | FENG Ji-cai, JING Xiang-meng, ZHANG Li-xia, LIU Hong. Interface structure and bonding strength of brazed joint of TiC cermet/steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (1): 5-8. |
[6] | LONG Zhi-li, HAN lei, WU Yun-xin, ZHOU Hong-quan. Effect of different temperature on strength of thermosonic bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (8): 23-26,38. |
[7] | ZOU Jia-sheng, ZHAI Jian-guang, CHU Ya-jie, CHEN Zheng. Effect of Ti foil thickness on interfacial structure and strength in PTLP bonding of Si3N4/Ti/Cu/Ti/Si3N4[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (6): 19-22. |
[8] | YANG Min, ZOU Zeng-da, LIU Xiu-zhong, WANG Yu-fu, CUI Feng-you. Strength and fracture behavior of Si3N4 ceramic/Inconel 600 alloy liquid phase inductive diffusion bonding joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (4): 36-38,42. |
[9] | Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174. |
[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |