Citation: | ZHANG Jiu-hai, HE Peng. Numeric Simulation for Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (4): 84-91. |
[1] | YU Bo, LI Xiaoyan, YAO Peng, ZHU Yongxin. Numerical simulation of diffusion behavior of Cu3Sn/Cu interface based on molecular dynamics[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(8): 50-54. DOI: 10.12073/j.hjxb.20150418001 |
[2] | LI Haixin, LIN Tiesong, HE Peng, FENG Jicai. Numerical simulation of residual stress in diffusion bonded TiAl/Ti/GH99 alloy joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (8): 38-42. |
[3] | YANG Yang, LU Hao, YU Chun, CHEN Junmei, CHEN Zhenying. Effect of Zn on formation of voids on SnxZn/Cu interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (1): 53-56. |
[4] | LI Haixin, LIN Tiesong, HE Peng, WEI Hongmei, FENG Jicai. Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (6): 43-46. |
[5] | HUANG Wanqun, LI Yajiang, WANG Juan, SHEN Xiaoqin. Microstructure of Al2O3-TiC composite ceramics and Q235 steel diffusion bonded interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (8): 101-104. |
[6] | XUAN Fuzhen, ZHANG Bo, LI Shuxin. Numerical simulation on microdefect evaluation of diffusion bonded joints by resistance approach[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (4): 9-12. |
[7] | HE Peng, FENG Ji-cai, QIAN Yi-yu, HAN Jie-chai, MAI Han-hui, JIA jin-guo. Numeric Analysis for Density Distribution of Element at the Interface in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2002, (3): 80-82. |
[8] | HE Peng, ZHANG Jiu-hai, FENG Ji-cai, QIAN Yi-yu. Numeric Simulation for Interface Intermetallic Compounds of Phase Transformation Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 75-78. |
[9] | Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174. |
[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |