Quality control and reliability of PQFP device solder joints

ZHANG Wei; LIU Kunpeng; XIANG Gang; ZHANG Yunxuan; YU Muying; WANG Shang; TIAN Yanhong

doi:10.12073/j.hjxb.20240416001

TRANSACTIONS OF THE CHINA WELDING INSTITUTION > 2025 > 46(6): 1-10. > DOI: 10.12073/j.hjxb.20240416001

ZHANG Wei, LIU Kunpeng, XIANG Gang, ZHANG Yunxuan, YU Muying, WANG Shang, TIAN Yanhong. Quality control and reliability of PQFP device solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(6): 1-10. DOI: 10.12073/j.hjxb.20240416001

Citation:

PDF (10784 KB)

Quality control and reliability of PQFP device solder joints

1.
State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin, 150001, China
2.
Beijing Aerospace Automatic Control Institute, Beijing, 100854, China

More Information

Received Date: April 15, 2024
Available Online: May 13, 2025

Graphical Abstract

Abstract

Abstract

In view of the long-term storage reliability issues of PQFP devices in aerospace applications, the optimization of solder joint process parameters and the evolution mechanism of IMCs were systematically investigated. Through optical microscopy, mechanical property testing, and scanning electron microscopy analysis, the influence mechanisms of weld height and soldering alloy volume on solder joint quality were revealed. The results show that increasing soldering alloy volume enhances wetting height (the theoretical optimal range is 0.05 ~ 0.099 3 mm³), while greater weld height diminishes wetting effects. The combination of a 0.12 mm steel mesh and 0.05 mm weld height achieves the lowest bridging rate and optimal tensile strength. High-temperature accelerated aging experiments demonstrate that Cu₆Sn₅/Cu₃Sn IMCs on the Cu bonding pad side evolve from a scalloped to planar morphology, while the Ni barrier layer reduces the thickness of (Cu,Ni)₆Sn₅ IMCs on the lead side. A kinetics model for IMC growth, based on Fick’s diffusion law, indicates parabolic growth behavior for bilateral IMC layers, with activation energies of 20.67 kJ/mol (Cu side) and 52.79 kJ/mol (Ni side). By using a critical IMC thickness of 3.5 μm as the failure criterion, the estimated storage life of solder joints at 23 ℃ reaches 27.5 years. This research provides theoretical foundations and data support for the long-term reliability design and process optimization of aerospace electronic systems.
- plastic quad flat package,
- soldering alloy volume,
- weld height,
- interfacial intermetallic compound,
- life prediction

FullText(HTML)

References (14)

References

[1]	黄姣英, 曹阳, 高成. 微电子封装焊点疲劳失效研究综述[J]. 电子元件与材料, 2020, 39(10): 11 − 16. HUANG Jiaoying, CAO Yang, GAO Cheng, et al. A review of fatigue failure of microelectronic packaging solder joints.[J]. Electronic Components and Materials, 2020, 39(10): 11 − 16.
[2]	中国航天工业总公司. 航天电子电气产品安装通用技术要求: QJ 165B—2014. [S]. 北京, 国家国防科技工业局, 2014. China national aerospace industry corporation. general technical requirements for aerospace electronic and electrical product assembly: QJ 165B—2014. [S]. Beijing, State Administration of National Defence Science and Technology Industry, 2014.
[3]	王国忠, 王春青, 钱乙余. SMT焊点元件与基板间隙的预测及其对焊点三维形态的影响[J]. 电子工艺技术, 1997(2): 18 − 20. WANG Guozhong, WANG Chunqing, Qian Yiyu. Prediction of component-substrate gap in SMT solder joints and its effecton the three-dimensional morphology of solder joints[J]. Electronic Process Technology, 1997(2): 18 − 20.
[4]	何敏, 邓梦, 庄成波. 焊点形态对表贴引脚元器件振动应力的影响[J]. 电子元件与材料, 2021, 40(8): 800 − 807. HE Min, DENG Meng, ZHUANG Chengbo. Influence of solder joint morphology on vibration stress of surface-mounted pincomponents[J]. Electronic Components and Materials, 2021, 40(8): 800 − 807.
[5]	HUBBARD K, HU M, AHMAD M. Solder joint shape prediction using a modified perzyna viscoplastic model[J]. Journal of Electronic Packaging, 2004, 127(3): 290 − 298.
[6]	ADETUNJI O R, ASHIMOLOWO R A, AIYEDUN P O, et al. Tensile, hardness and microstructural properties of Sn–Pb solder alloys[J]. Mater Today Proc, 2021, 44: 321.
[7]	QIAO Y Y, MA H T, YU F Y, et al. Quasi-in-situobservation ondiffusion anisotropy dominated asymmetrical growth of Cu–Sn IMCs under temperature gradient[J]. Acta Materiali, 2021, 217(9): 117168.
[8]	田德文. 熔滴与平面和角形结构碰撞的动态行为及形态[D]. 哈尔滨: 哈尔滨工业大学, 2011. TIAN Dewen. Dynamic behavior and sharp of molten droplet impact on planar and corner structures[D]. Harbin: Harbin Tnstiture of Technology, 2011.
[9]	WANG J N, CHEN J S, ZHANG Z Y, et al. Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/singlecrystal) joints[J]. Soldering & Surface MountTechnology, 2022, 34(2): 124 − 133.
[10]	GEORGE Vakanas, NELE Moelans, MASANORI Kajihara, et al. Formation of compounds and Kirkendall vacancy in the Cu–Sn system[J]. Microelectronic Engineering, 2014, 40(5): 133 − 137.
[11]	GRÉTA Gergely, ZOLTÁN Gácsi. Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition.[J]. Journal of Materials Research and Technology, 2023, 24(6): 8320 − 8331.
[12]	WANG Y, PENG X W, HUANG J H, et al. Studies of Cu-Sn interdiffusion coefficients in Cu₃Sn and Cu₆Sn₅ based on the growth kinetics[J]. Scripta Materialia, 2021, 204(11): 114138 − 114144.
[13]	ZHAO D D, GUO W J, SHANG Z C, et al. The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600 ℃–800 ℃[J]. Tntermetallics, 2024, 168(5): 108244.
[14]	张贺, 冯佳运, 丛森,等. 62Sn36Pb2Ag组装焊点长期贮存界面化合物生长动力学及寿命预测[J]. 工程科学学报, 2023, 3(45): 400 − 406. ZHANG He, FENG Jiayun, CONG Sen, et al. Long-term storage life prediction and growth kinetics of intermetallic compounds in 62Sn36Pb2Ag solder joints[J]. Chinese Journal of Engineering, 2023, 3(45): 400 − 406.

[1]	REN Xianghui, MA Teng, WU Wei, HAN Shanguo. Microstructure and properties of 316L stainless steel parts fabricated by double wire CMT + P additive manufacturing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(3): 96-103. DOI: 10.12073/j.hjxb.20231207001
[2]	SU Guoxing, SHI Yu, ZHU Ming, ZHANG Gang. Microstructure and properties of Inconel 718 cladding layer efficiently fabricated by laser metal deposition with hot wire[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240628003
[3]	REN Xianghui, LIANG Wenqi, WANG Ruichao, HAN Shanguo, WU Wei. Effects of different welding modes on microstructure and mechanical properties of 316 stainless steel by wire arc additive manufacturing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(4): 79-85, 92. DOI: 10.12073/j.hjxb.20230413002
[4]	WU Kai, BU Zhixiang, KUANG Xiaocao, WEI Ligeng, WANG Lishi. Effect of the additional water-cooling on the microstructure and mechanical properties of wire arc additive manufacturing of 4047 aluminum alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(10): 127-132. DOI: 10.12073/j.hjxb.20221121002
[5]	WU Tao, TAN Zhen, WANG Liwei, LIANG Zhimin, WANG Dianlong. Microstructure and mechanical properties of Al-Mg-Cu alloy fabricated by heterogeneous twin-wire indirect arc additive manufacturing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(10): 64-70. DOI: 10.12073/j.hjxb.20230305003
[6]	CHEN Chao, SUN Guorui, FENG Tianting, FAN Chenglei, ZHANG Huijing. Microstructure and mechanical properties of aluminium alloy thin-wall parts in wire arc additive manufacturing hybrid interlayer high-speed friction[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(9): 38-43. DOI: 10.12073/j.hjxb.20220121001
[7]	AO Ni, HE Ziang, WU Shengchuan, PENG Xin, WU Zhengkai, ZHANG Zhenxian, ZHU Hongbin. Recent progress on the mechanical properties of laser additive manufacturing AlSi10Mg alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(9): 1-19. DOI: 10.12073/j.hjxb.20220413002
[8]	GUO Shun, WANG Pengxiang, ZHOU Qi, ZHU Jun, GU Jieren. Microstructure and mechanical properties of bimetallic intertexture structure fabricated by plasma arc additive manufacturing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(3): 14-19. DOI: 10.12073/j.hjxb.20201125004
[9]	CHEN Xiaohui, ZHANG Shuquan, RAN Xianzhe, HUANG Zheng. Effect of arc power on microstructure and mechanical properties of austenitic stainless steel 316L fabricated by high efficient arc additive manufacturing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(5): 42-49. DOI: 10.12073/j.hjxb.20190818001
[10]	AN Tongbang, TIAN Zhiling, SHAN Jiguo, PENG Yun, WEI Jinshan. Effect of welding methods on microstructure and mechanical properties of 1 000 MPa grade deposited metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 101-104.

Cited By

Cited by

Periodical cited type(5)

1.	刘嘉伟，黄伟莉，胡积熠. 基于机器视觉的相贯线特征提取方法. 机电工程技术. 2024(05): 178-182 .
2.	张锦洲，姬世青，谭创. 融合卷积神经网络和双边滤波的相贯线焊缝提取算法. 吉林大学学报(工学版). 2024(08): 2313-2318 .
3.	杜瑞锋，但敏，王云馨. 基于计算机建模的圆柱体相贯线展开图研究. 忻州师范学院学报. 2024(05): 18-25 .
4.	谢昊，郭天太，王浩. 基于分段拟合算法的V型焊缝识别. 现代电子技术. 2023(20): 153-158 .
5.	董益民. 面向智慧物流的码垛机器人自动离线编程系统. 信息技术与信息化. 2023(10): 200-203 .

Other cited types(0)

Get Citation

PDF

XML

Article views (61) PDF downloads (13) Cited by(5)

Turn off MathJax

Article Contents

Abstract

References

Quality control and reliability of PQFP device solder joints