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SUN Lei1, CHEN Minghe1, XIE Lansheng1, ZHANG Liang2, ZHU Jiandong3. Properties and mechanism of nano Al particles reinforced Sn1.0Ag0.5Cu solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(8): 47-50. DOI: 10.12073/j.hjxb.2018390199
Citation: SUN Lei1, CHEN Minghe1, XIE Lansheng1, ZHANG Liang2, ZHU Jiandong3. Properties and mechanism of nano Al particles reinforced Sn1.0Ag0.5Cu solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(8): 47-50. DOI: 10.12073/j.hjxb.2018390199
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Properties and mechanism of nano Al particles reinforced Sn1.0Ag0.5Cu solders

  • 1. College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;
    2. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China;
    3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

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  • Received Date: April 14, 2017
    Graphical Abstract
    • Abstract
  • Sn1.0Ag0.5Cu-xAl composite solders were prepared by mechanically mixing method. The effect of nano Al particles on the microstructure and properties of Sn1.0Ag0.5Cu solder were investigated by differnetial scanning calorimetry, STR-1000 micro-joint strength tester and SEM. The results showed that adding nano Al particles does not cause a considerable change in the melting temperature. All samples ranged from 226.9 to 229℃. With the addition of nano Al particles, the wetting angle was decreased and mechanical property was increased. When the addition of nano Al particles was 0.1%, the pull force of solder joint reached the maximum, which was 7.1 N. In addition, the microstructure of Sn1.0Ag0.5Cu-0.1Al solder was significantly refined, and the thickness of interfacial intermetallic compounds (IMC) was effectively inhibited, which may attributed to the adsorption of nanoparticles.
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    • References (14)
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