| Citation: |
JIA Keming, WANG Lifeng, ZHANG Shiyong, LIU Haitao. Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 94-98. DOI: 10.12073/j.hjxb.2018390076
|
|
高瑞婷, 李晓延, 朱永鑫, 等. 加载速率和钎料厚度对SnAgCu/Cu焊点剪切行为影响[J]. 焊接学报, 2016, 37(2): 94-98.Gao Ruiting, Li Xiaoyan, Zhu Yongxin,et al. Effect of loading rates and solder thickness on shear behav-ior of SnAgCu/Cu lead-free solder joint[J]. Transactions of the China Welding Institution, 2016, 37(2): 94-98.[2] Reza J M, Jung S B. Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging[J]. Microelectronic Reliability, 2007, 47(12): 2169-2178.[3] 李勋平. BGA结构Cu(Ni)/Sn-3.0Ag-0.5Cu/Ni(Cu)微焊点显微组织形成和演化及剪切断裂行为的尺寸效应[D]. 广州: 华南理工大学, 2011.[4] Moy W H, Shen Y L. On the failure path in shear-tested solder joints[J]. Microelectronics Reliability, 2007, 47(8): 1300-1305.[5] Zhao J, Cheng C Q, Qi L,et al. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples[J]. Journal of Alloys and Compounds, 2009, 473(1-2): 382-388.[6] 戴文勤, 王丽凤, 何 冰, 等. La对Sn-0.3Ag-0.7Cu回流焊点纳米力学性能影响[J]. 焊接学报, 2015, 36(9): 75-78.Dai Wenqin, Wang Lifeng, He Bing,et al. Effect of La on nano mechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints[J]. Transactions of the China Welding Institution, 2015, 36(9): 75-78.[7] Shi Y W, Tian J, Hao H,et al. Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. Journal of Alloys and Compounds, 2008, 453(2): 180-181.[8] Benlih H, Hong S H, Ning C L. A compliant and creep resistant SAC-Al(Ni) alloy[C]∥Proceedings 57th Electronic Components and Technology Conference. Reno, Nevada, USA, 2007: 184-191.[9] 谷柏松, 孟工戈, 孙凤莲, 等. Sn-3.0Ag-0.5Cu/Ni/Cu微焊点剪切强度与断口的研究[J]. 电子元件与材料, 2013, 32(3): 70-76.Gu Baisong, Meng Gongge, Sun Fenglian,et al. Study on shear strength and fracture surface of Sn-3.0Ag-0.5Cu/Ni/Cu micro solder joints[J]. Electronic Components and Materials, 2013, 32(3): 70-76.
|
| [1] | YANG Xuexia, SUN Qinrun, ZHANG Weiwei. Structure optimization design of BGA solder joints based on surface response method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(11): 36-41. DOI: 10.12073/j.hjxb.20220810002 |
| [2] | ZHANG Shiyong, WANG Lifeng, BAI Yuhui, LIU Juan, JIA Keming. Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(8): 124-130. DOI: 10.12073/j.hjxb.2019400220 |
| [3] | HUANG Jun, ZHAI Ziyang, WANG Kehong, SONG Kai. Simulation and experiment on multi-pass welding of 616 armor steel with thick plate structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(11): 89-93. DOI: 10.12073/j.hjxb.2018390279 |
| [4] | ZHU Xinjie<sup>1,2</sup>, DENG Mingxi<sup>2,3</sup>. Action mechanism of acoustic scattering in synthetic aperture array imaging of ultrasonic guided waves in plate with welding structures[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(7): 65-70. DOI: 10.12073/j.hjxb.2018390177 |
| [6] | ZHANG Yi, LIU Xixia, SHI Rukun, WANG Xia, YANG Xiong. Numerical simulation of deep-penetration laser welding based on level-set method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(4): 29-34. |
| [7] | ZHAO Zhili, XU Xirui, SUN Fenglian, YANG Jianguo. Shear behavior of copper column grid array interconnect structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(4): 79-82. |
| [8] | WANG Guilan, WANG Qing, WANG Xiangping, ZHANG Haiou. Simulation of plasma deposition manufacturing process for functionally graded material using level-set approach[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (11): 1-4,8. |
| [9] | YAN Dejun, LIU Xuesong, ZHOU Guangtao, FANG Hongyuan. Numerical analysis on optimizing welding sequence of large-sized bottom structure for controlling welding distortion[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (6): 55-58. |
| [10] | LI Yana, ZHAO Wenzhong, LU Bihong, NIE Chunge. Welding distortion prediction and control of thin-plate welded structures of the truck side-walls[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (4): 25-28. |
Supported by:
Beijing Renhe Information Technology Co. Ltd
DownLoad: