Advanced Search
QIU Xiliang, HAO Chengli, XIU Ziyang, HE Peng. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
Citation: QIU Xiliang, HAO Chengli, XIU Ziyang, HE Peng. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
shu

Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders

  • 1.

    State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 2.

    Beijing Huahang Radio Measurement & Research Institute, Beijing 100013, China

More Information
  • Received Date: October 08, 2016
    Graphical Abstract
    • Abstract
  • In the present work, Sn-58Bi composite solders with different amount of graphene nanoplates (GNSs) have been prepared by powder metallurgy method. The melting point of the solder was slightly affected by the addition of few amount of GNSs. With the increase of the amount of GNPs, the density and vickers microhardness were firstly increased to the peak value and then decreased with further addition of GNSs. It has been found that the brazed joint of Sn-58Bi/Cu substrate could be significantly improved by the addition of GNSs. The improvement should be attributed to the grain refinement and the dispersion strengthening effect of GNSs.
    • FullText(HTML)
    • References (8)
  • 赵玉琳. 铅污染对儿童健康的影响综述[J]. 安徽预防医学杂志, 2005, 8(3): 163-166. Zhao Yulin. Areview of lead pollution on children's health[J]. Journal of Anhui Preventive Medicine, 2005, 8(3): 163-166.
    Yang L, Dai J, Zhang Y, et al. Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder[J]. Journal of Electronic Materials, 2015, 44(7): 2473-2478.
    Zhang C, Liu S, Qian G,et al. Effect of Sb content on properties of Sn-Bi solders[J]. Transactions of Nonferrous Metals Society of China, 2014, 24(1): 184-191.
    夏志东, 雷永平, 史耀武. 绿色高性能无铅钎料的研究与发展[J]. 电子工艺技术, 2002, 23(5): 185-191. Xia Zhidong, Lei Yongping, Shi Yaowu.Research and development of green high performance lead-free solder[J]. Electronic Process Technology, 2002, 23(5): 185-191.
    明 亮. 关于石墨稀材料在未来应用的前景及其制作工艺的研讨[J]. 科技创新与应用, 2013(19): 14-15. Ming Liang.Discussion on the prospect of graphene materials in the future and its manufacturing technology[J]. Science & Technology Innovation and Application, 2013(19): 14-15.
    黄亦龙. 石墨烯+Sn-Ag-Cu复合钎料性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2015.
    陈国华. 石墨烯微片的制备及其产业化相关问题[C]//2010年全国高分子材料科学与工程研讨会学术论文集(上册). 南昌: 江西人民出版社, 2010: 327-328.
    刘晓英. Sn基复合无铅钎料的研究[D]. 大连: 大连理工大学, 2010.
    • Related Articles

  • Related Articles

    [1]ZHANG Yukun, CHEN Jichun, ZHANG Jinsong. Microstructure and shear strength of the C/SiC and Q235 brazing joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(7): 78-82. DOI: 10.12073/j.hjxb.20191010001
    [2]MA Qunshuang, LI Yajiang, WANG Juan, DUAN Huming, XU Guangyuan. Microstructure characteristics and shear strength of wide-band laser clad Ni60 composite coatings reinforced with WC particle[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(12): 49-52.
    [3]XU Yuanyuan, YAN Yanfu, FENG Lifang, . Effect of content of Ni on wettability and shear strength of BiSbSnNi solder alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(7): 31-34.
    [4]WU Na, LI Yajiang, WANG Juan. Microstructure and shear strength of high-temperature brazed joint of Super-Ni/NiCr laminated composite using Ni-Cr-Si-B filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(1): 9-12,36.
    [5]LU Wei, ZHANG Ning, SHI Yaowu, LEI Yongping. Effect of loading rate on shear strength of SnAgCu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 57-60.
    [6]MENG Gongge, LI Zhengping. Shear strength and fracture surface analysis of BiAgNiCuGe/Cujoint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (10): 45-48.
    [7]WANG Juan, LI Yajiang, S. A. GERASIMOV. Microstructure and shear strength of diffusion brazed Al2O3-TiC/Q235 joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 25-28.
    [8]XUE Song-bai, HU Yong-fang, YU Sheng-lin, WU Yu-xiu. Effects of thermal cycling on shear strength and microstructures of soldered joints of ceramic ball grid array package[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (6): 1-4.
    [9]XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64.
    [10]WANG Juan, LI Ya-jiang, LIU Peng. Shear strength and microstructure in Fe3Al/Q235 diffusion bonded joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (5): 81-84.

Catalog

    Get Citation
    PDF
    XML
    Article views (402) PDF downloads (313) Cited by()
    Turn off MathJax
    Article Contents
    Abstract
    References
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return