Process, microstructure and property of asymmetric rolled Cu/Al composites
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Graphical Abstract
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Abstract
Copper/aluminium laminated composites were produced by asymmetric rolling, which were annealed subsequently. Their microstructure and properties were investigated by optical microscope(OM), scanning electron microscope(SEM) and tensile testing machine, respectively. The results revealed that wavy morphology of interface was reduced significantly and became more smooth compared with synchronous roll bonding. Under the same reduction ratio, the rolling force is less than the symmetrical rolling, which improves the stability and accuracy of the rolling process and benefits the peeling strength. Also, asymmetric speed ratio and peeling strength of the composite show parabola relationship. When the speed ratio is 1.25, the peeling strength reaches its maximum. When asynchronous ratio increases, the thickness ratio of Cu to Al rises. The results have significance in the fabrication of copper/aluminium clad composite.
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