Optimization design of 3D-TSV interconnect structure under random vibration load based on orthogonal experiment and gray relational analysis

The 3D finite element analysis models of 3D-TSV interconnect structure were developed and done random vibration analysis. The maximum equivalent stress, the maximum equivalent strain, the first order natural frequency and the second order natural frequency as the objective function of the TSV interconnect structure. The TSV height, the TSV diameter, the micro-bump diameter and the micro-bump height as design variable to multi objective optimization design. The multifactorial and multi-objective optimization design based on orthogonal experiment and gray relational analysis, it obtains the optimal parameter level combination. The maximum equivalent stress of the TSV interconnect structure is reduced by 4.59%, the maximum equivalent effect is reduced by 22.56%, and the first order natural frequency is increased by 4.91%, and the second order natural frequency is increased by 4.46%. The research shows:using the combination method based on orthogonal experiment and gray relational analysis it achieved the multi-objective optimization about TSV interconnect structure. It has high practicability to improve the comprehensive performance of TSV interconnect structure under random vibration condition.