Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints
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Graphical Abstract
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Abstract
Effect of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during reflow process was investigated in this study. Flux-driven ripening (FDR) theoretical model is adopted to analyze the Cu6Sn5 IMC grain ripening growth mechanism. Results show that nano-TiO2 dopant could alter both the morphology and size of Cu6Sn5 IMC grain. The size of Cu6Sn5 IMC grain in TiO2-containg solder joints is smaller than that in TiO2-free solder joints, and the Cu6Sn5 IMC grain in TiO2-containg solder joints is more uniform and evenly distributed than those in TiO2-free solder joints. The FDR theoretical model was well consistent with the experimental data. The growth exponents of Cu6Sn5 IMC grain in Sn-3.0Ag-0.5Cu-xTiO2 solder joints are 0.346, 0.338, 0.332, and 0.342, respectively. This indicates that Cu6Sn5 IMC grain growth is controlled by atomic interdiffusion and grain maturity.
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