Interface behavior and performance of laser induced brazing for SiCp/Al composite

Laser induced brazing was proposed in terms of the particularity of T/R module packaging structure. SiCp/Al composites containing 55% SiCp was chosen as base metals. According to the particularity of temperature field induced by laser, brazing test was conducted under Ar atmosphere, using four kinds of solder, including AlZn25Si1, ZnAl7, nanometer Al powder and micro particles of Sn. The interfacial microstructures and fracture surfaces were investigated by SEM and EDS. Laser parameters were determined to ensure the composites surface being free from thermal damage and molten solder interface. The results show that low melting solder ZnAl7 and nanometer Al powder were easy to obtain a better brazing joint, which can realize metallurgical bonding by diffusion. The fracture analysis indicates that the fracture lies on the base material side and has certain strength.