Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder

The effect of Nd on the wettability, microstructure and mechanical properties of Sn-0.3Ag-0.7Cu solder was investigated. The results indicated that the wettability of Sn-0.3Ag-0.7Cu was significantly improved with the addition of Nd and the microstructure of Sn-0.3Ag-0.7Cu was refined. When the amount of Nd reached to 0.1%, the wettability and mechanical properties of the solder were optimal. In addition, the wettability of Sn-0.3Ag-0.7Cu-0.1Nd approaching to Sn-3.8Ag-0.7Cu solder although the wettability of Sn-0.3Ag-0.7Cu solder is poorer due to the decrease of Ag adding.