An improved three-dimensional reconstruction algorithm for microelectronics assembly solder joint

Solder joint three-dimensional(3D) reconstruction is one of the key research of microelectronic assembly quality 3D detection and control technology development. During the solder joint 3D reconstruction based on SFS theory, its 3D reconstruction becomes one of the key problems because of existing "high light area" on solder joint surface. In order to resolve the problem, at first, by analyzing the reflection items on solder joint surface, a reflection model is got for microelectronics solder joint according to the characteristics of joint surface and solder joint image. Then, by analyzing the formation principle of "high light area" and modifying the reconstruction result, an improved 3D reconstruction algorithm is proposed for microelectronics assembly solder joint. At last, the experimental results have shown that the"distortion"can be solved and the 3D shape based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.s