Low temperature sintering-bonding and the performance of joints using Ag₂O paste with an adding of Ag-coated Cu particles

The micro-scaled Ag₂O paste is cheaper than Ag nanoparticle paste and has a promising application prospect in high temperature electronic packaging industry. In order to further reduce the cost and improve the joint ability of the resistance to electrochemical migration (ECM),the Ag-coated Cu particles were added into the original micro-scaled Ag₂O paste to make a new composite paste. In this paper,the shear strength of joints obtained by using the original Ag₂O paste and the new Ag₂O paste contained Ag-coated Cu particles and the two sintered pastes' ability of resistance to ECM were compared. The results revealed that the average shear strength of joints obtained by using the new Ag₂O paste with Ag-coated copper at the typical bonding condition (250℃,5 min,2 MPa) showed an obvious decrease,while the ability of the resistance to ECM got a significant increase due to the addition of Ag-coated Cu particles.