Formation mechanism and microstructure of C_f/Al and TiAl joint by SHS joining with Al-Ni-CuO interlayer

C_f/Al composites and TiAl alloys were joined by SHS joining with Al-Ni-CuO interlayer in the vacuum furnace.High quality joint was obtained.DTA curve of Al-Ni-CuO interlayer was analyzed.Heat production mechanism of Al-Ni-CuO interlayer was analyzed and the interface formation of C_f/Al and TiAl joint was introduced.The result showed that Al atoms react with CuO when the temperature rises to 500℃,and release a large quantity of heat.When the heating temperature reaches 600℃,the real temperature on local part of interlayer has already achieved the melting point of Al.Al starts to melt.The liquid Al surrounds the solid Ni,and reacts with each other to form NiAl₃.In final joint,TiAl3 layer forms on the interface of TiAl and Al- Ni-CuO interlayer.NiAl₃ appears on the interface of C_f/Al and Al-Ni-CuO interlayer.In the C_f/Al,Ni in Al-Ni-CuO layer diffuses toward to C_f/Al and forms NiAl₃.