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HAN Ruonan, XUE Songbai, HU Yuhua, WANG Zongyang, JA Jianyi. Development of flux for Sn-Zn lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (10): 101-104.
Citation: HAN Ruonan, XUE Songbai, HU Yuhua, WANG Zongyang, JA Jianyi. Development of flux for Sn-Zn lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (10): 101-104.

Development of flux for Sn-Zn lead-free solder

  • The speadabitity of Sn-9Zn solder on Cu substrate with four different types of flux was studied by spreading experiment method.The experimental results indicated that Sn-9Zn solder, matching the flux-A4 with stannous sulfonate(20%) as the main activator without halogen which exhibited excellent wettability.The largest spreading area was 65.7 mm2, increased respeetively by 16.1%, 116.1%, 85.1% compared with the NH4Cl-ZnCl2, resin and water-solubility fluxes.Besides, the newly developed flux with combination of 20% stannous sulfonate and diethanolamine, succinic acid could remarkably improve the wettabiltiy of Sn-9Zn solder that the largest spreading areas were 76.5 mm2, 72.5 mm2 when the contents of diethanolamine, succinic acid were at 8%, 10%.
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