Citation: | LI Haixin, LIN Tiesong, HE Peng, WEI Hongmei, FENG Jicai. Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (6): 43-46. |
[1] | NIE Chunge, WEI Hongliang, DONG Pingsha, ZHAO Wenzhong. Shear strength analysis of transverse fillet welds based on structural stress method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 70-74. |
[2] | LI Haixin, WEI Hongmei, HE Peng, FENG Jicai. Interfacial microstructure and bonding strength of diffusion bonded TiAl/Ti/Nb/GH99 alloy joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (9): 9-12. |
[3] | LU Wei, ZHANG Ning, SHI Yaowu, LEI Yongping. Effect of loading rate on shear strength of SnAgCu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 57-60. |
[4] | HUANG Wanqun, LI Yajiang, WANG Juan, SHEN Xiaoqin. Microstructure of Al2O3-TiC composite ceramics and Q235 steel diffusion bonded interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (8): 101-104. |
[5] | MENG Gongge, LI Zhengping. Shear strength and fracture surface analysis of BiAgNiCuGe/Cujoint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (10): 45-48. |
[6] | HE Peng, YANG Xiujuan, FENG Jicai, LIU Hong. Effects of holding time on interface structure and bonding strength of brazed joint of hydrogenated TC4 titanium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (2): 1-4. |
[7] | XUE Song-bai, HU Yong-fang, YU Sheng-lin, WU Yu-xiu. Effects of thermal cycling on shear strength and microstructures of soldered joints of ceramic ball grid array package[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (6): 1-4. |
[8] | XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64. |
[9] | Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174. |
[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |