Citation: | LI Haixin, LIN Tiesong, HE Peng, WEI Hongmei, FENG Jicai. Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (6): 43-46. |
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[2] | LI Haixin, WEI Hongmei, HE Peng, FENG Jicai. Interfacial microstructure and bonding strength of diffusion bonded TiAl/Ti/Nb/GH99 alloy joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (9): 9-12. |
[3] | LIU Shuying, ZHANG Guifeng, LIU Guangbao, XU Peili, WANG Yawei. Microstructure characteristic and performance of bonding interface between titanium alloy/copper/GCr15[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 69-72,76. |
[4] | LU Wei, ZHANG Ning, SHI Yaowu, LEI Yongping. Effect of loading rate on shear strength of SnAgCu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 57-60. |
[5] | HE Peng, YANG Xiujuan, FENG Jicai, LIU Hong. Effects of holding time on interface structure and bonding strength of brazed joint of hydrogenated TC4 titanium alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (2): 1-4. |
[6] | XUE Song-bai, HU Yong-Fang, YU Sheng-lin. Study on shear strength of soldered joints of BGA packaging devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 62-64. |
[7] | XIANG Xing-hua, MU Xiaodong, LIU Zheng-yi, LI Shang-zhou. Study on the Morphology and Action of the Interface Between Ni Base Self-Fluxing Alloy Coating and Steel Substrate[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2002, (3): 45-48. |
[8] | Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174. |
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[10] | Feng Jicai, Liu Huijie, Han Shengyang, Li Zhuoran, Zhang Jiuhai. Interface Structures and Bonding Strength of SiC/Nb/SiC Diffusion Bonded Joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (2): 20-23. |