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LI Haixin, LIN Tiesong, HE Peng, WEI Hongmei, FENG Jicai. Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (6): 43-46.
Citation: LI Haixin, LIN Tiesong, HE Peng, WEI Hongmei, FENG Jicai. Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (6): 43-46.

Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy

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  • Received Date: April 17, 2011
  • Diffusion bonding of TiAl to Ni-based alloy(GH99) with Ti interlayer was carried out.The reaction products and the interface structures of the joints were investigated by scanning electron microscopy,electron probe X-ray microanalysis and X-ray diffraction.The results show that four kinds of reaction layers are formed at the interface between the GH99 alloy and Ti interlayer,such as(Ni,Cr)ss,rich Ti-(Ni,Cr)ss,TiNi and Ti2Ni.When the holding time is short,Ti(Al)ss layer is formed at the interface between Ti interlayer and TiAl alloy.With the holding time increasing,the Ti(Al)ss reaction layer transformed into Ti3Al and Al3NiTi2.With the holding time increasing,the thickness of TiNi reaction layer increases,while the thickness of Ti2Ni layer increases firstly and then decreases.The shear test results show that the shear strength of the joint increases at first,then decreases,and then increases with the holding time increasing.The fractographs of the joints show that the fracture mainly occurs in the Ti2Ni reaction layer.
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