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[2] | HUANG Huizhen, ZHAO Yanan, PENG Ruyi, DUAN Yuande. Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 23-28. DOI: 10.12073/j.hjxb.2019400149 |
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[6] | ZHOU Yong, YANG Guanjun, WANG Hongduo, LI Geng, LI Changjiu. Effect of annealing treamenton formation of intermetallic phase in cold-sprayed Ni/Ti mechanical alloying coating[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (8): 45-48. |
[7] | ZHU Dongmei, WANG Xibao. Mcrostrueture of Fe3A1 intermetallic compound produced by plasma cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (12): 17-19,24. |
[8] | FU Li, DU Sui-geng. Effect of external electric field on diffusion behavior of copper andstainless steel friction welded joint during post weld annealing treatment[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (3): 71-74. |
[9] | HE Peng, FENG Ji-cai, QIAN Yi-yu, ZHANG Jiu-hai. Forming Mechanism of interface intermetallic Compounds for Difusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2001, (1): 53-55. |
[10] | HE Peng, ZHANG Jiu-hai, FENG Ji-cai, QIAN Yi-yu. Numeric Simulation for Interface Intermetallic Compounds of Phase Transformation Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 75-78. |
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