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HOU Pingjun, WANG Hangong, WANG Liuying, YUAN Xiaojing. Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 97-100,104.
Citation: HOU Pingjun, WANG Hangong, WANG Liuying, YUAN Xiaojing. Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 97-100,104.

Numerical simulation on deposition process of duplex thermal barrier coating by plasma spraying

  • Numerical simulation was performed by finite element analysis(FEA) to investigate the temperature and stress in a typical duplex thermal barrier coating.During the spraying process, the temperature of the back surface of substrate increases step by step, both the temperature and the stress of the coating fluctuate periodically within a wide range.After the deposition, the specimen was cooled to the room temperature slowly.The stresses become constant values, and the maximum radial tensile stress exists at the interface between the ceramic layer and the bonding layer, and the maximum axial and shear stresses exist at the interface, where is the concentrated stress area.The stresses of the middle interfaces are uniform.The maximum tensile stress on the ceramic layer surface is 423.7 MPa.
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