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ZHAO Huihuang, ZHOU Dejian, HUANG Chunyue. 3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 77-80.
Citation: ZHAO Huihuang, ZHOU Dejian, HUANG Chunyue. 3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 77-80.
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3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model

  • 1.

    School of Mechanical and Electronical Engineering, Xidian University, Xi'an 710071, China

  • 2.

    Department of Mechanical Engineering, Guangxi University of Technology, Liuzhou 545006, Guangxi, China;School of Mechanical and Electronical Engineering, Guilin University of Electronic Technology, Guilin 541004, Guangxi, China

  • 3.

    School of Mechanical and Electronical Engineering, Guilin University of Electronic Technology, Guilin 541004, Guangxi, China

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  • Received Date: February 22, 2009
    Graphical Abstract
    • Abstract
  • Three-dimensional shape and its accuracy are dissatisfactory because of the highlight caused by specular reflection when the shape from shading is used to reconstruct the three-dimensional soldered joint.An improved illumination model is proposed, which can modify the diffuse reflectance component based on the features of image shooting, make a linear superposition for both specular reflection component and diffuse reflectance component.Then the improved illumination model is used to reconstruct the three-dimensional soldered joint after dealing with the soldered joint image by the proper image processing arithmetic.The experimental results show that the 3D shape by SFS based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.
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