Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy

The effect of adding trace elements of Ni, P and Ce on the oxidation resistance and solidification crack of SAC305 solder alloys is investigated.Experimental results indicate that adding Ni can decrease the length of solidification crack and depress the formation of the crack, but can not improve the oxidation resistance of SAC305 solder alloy.Trace P addition, which forms a dense oxidation barrier on the surface of the solder, can improve the oxidation resistance of solder, but aggravates the formation of solidification crack on the surface of solder alloys.Addition of Ce can deteriorate the oxidation resistance of SAC305 solder alloy and slightly depress the solidification crack on the surface of the alloys.