Diffusion bonding using powders with a high-content of 2223 phase for superconducting Bi-based tapes

A powder interlayer with a content 88.5% of superconducting phase 2223 was obtained by combining pressing technology and high temperature sintering from the precursor powders used for fabricating BSCCO tapes.The pressing technology is beneficial to increasing the formation and content of 2223 phase from the precursor powders.A good superconducting bonding quality was achieved using this powder interlayer.The average critical current ratio(CCRo)reached up to 49.9% under the conditions of bonding temperature 800℃ for 2 h at 3 MPa.And it is concluded that the higher the content of 2223 phase in the powder interlayer, the higher the CCRo is.The influences of bonding factors on the joints' microstructures are both obvious and complex, and a further research on this is needed.