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MENG Gongge, LI Caifu, YANG Tuoyu, CHEN Leida. Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 59-62.
Citation: MENG Gongge, LI Caifu, YANG Tuoyu, CHEN Leida. Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (9): 59-62.
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Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint

  • 1.

    School of Material Science & Engineering, Harbin University of Science and Technology, Harbin 150040, China

  • 2.

    Institute of Metal Research Chinese Academy of Sciences, Shenyang 110016, China

  • 3.

    Anhui Science and Technology University, Bengbu 233100, Anhui, China

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  • Received Date: December 17, 2007
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    • Abstract
  • In Periodic Table of the Elements, germanium (Ge)is adjacent to tin.They are both the elements in the main group Ⅳ and resemble each other in physical and chemical property.A little element Ge was added into lead-free solder Sn2.5Ag0.7Cu (0.25, 0.5, 0.75, 1.0 wt%), and the shear test specimens were designed and welded.The joint shearing strengths were measured and fracture surfaces were analyzed by scanning electron microscope and energy dispersive X-ray analysis method.The result indicates that the shearing strength of the joint increases obviously. The joint fracture forms of the Sn-Ag-Cu-Ge lead-free solder are mainly ductile fracture, and most of them have secondary cracks. Lots of dimples formed on the fracture surface when adding element Ge, and IMC Cu6Sn5 play a part on the dimple forming.
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