Thermal cycling of rectangular chip resistor joints soldered with lead-free solder by diode laser

Soldering experiments of rectangular chip resistor components were carried out with Sn -Ag -Cu lead-free solder by diode laser soldering system and IR reflow soldering method, respectively, and the thermal cycling test of chip resistor component joints was also carried out.It is found that mechanical properties of chip resistor joints soldered by laser soldering system are better than the ones of chip resistor joints soldered by IR reflow soldering method; shear forces of chip resistor joints decrease gradually with the increasing of thermal cycling times, while at the same time, shear forces of laser soldered joints are larger than that of IR soldered joints.Shear fracture mode of chip resistor joints change from toughness fracture to brittle fracture as thermal cycling times increase.