Process of electroless copper plating on Al2O3 ceramics and its soldering at low temperature

Al₂O₃ ceramics was treated by electroless copper plating, the surface of Al₂O₃ pretreatment process was studied. The influence of concentration of liquor of copper sulfate, liquor formaldehyde, temperature and time of plating on the deposition rate were studied.Metallographical analysis of copper plating layer was done, and the optimum process was obtained.Soldering of Al₂O₃ ceramics after electroless copper plating at low temperature was produced, and the influence of different conditions of electroless plating process on microstructures and mechanical properties of joints was also studied.The results indicate that under the experimental conditions, with the increase of soldering temperature, the tightness of joint becomes worse;and when holding time increases, the soldering seam width will increase too.The increase of both copper sulfate and formaldehyde concentration and the thickness of plating layer relatively affect on the soldering seam width and quality.