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HOU Jinbao, ZHANG Lei, WEI Youhui. Microstructure and strength analysis of IC10 alloy TLP-DB joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 89-92.
Citation: HOU Jinbao, ZHANG Lei, WEI Youhui. Microstructure and strength analysis of IC10 alloy TLP-DB joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (3): 89-92.

Microstructure and strength analysis of IC10 alloy TLP-DB joint

  • TLP-DB(transient liquid phase diffusion bonding) experiments were carried out on IC10 alloy, which is one kind of intermetallic compound based on Ni3Al.Experimental results showed that with proper interface layer and welding parameters, microstructure of TLP-DB joints could be the same as the matrix, which consists of γ and γ 'phases.Endurance strengths of the joints under 980℃were above 128 MPa, and had reached 80% of the matrix.Employed for a long time at high temperature, tensile strengths of the joints under room temperature and high temperature were mostly close to the matrix.Fracture of room temperature tensile samples was mainly made up of quasi-cleavage pattern, and fracture of high temperature tensile samples was mainly made up of dimple pattern.
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