Diffusion bonding of TC4 to ZQSn10-10 with nickel and copper interlayers

The experimental investigation of the diffusion bonding of TC4 to ZQSn10-10 in vacuum was carried out by using pure nickel and copper as the transition metal.Experimental results show that the optimum bonding parameters were selected as follows:bonding temperature 850℃, bonding time 20 min and bonding pressure 10MPa.So the strength of the joint without obvious shape changing was up to 155.8 MPa, which the strength can reach to about 65% of the strength of base metal ZQSn10-10.Various reaction layers appeared in TC4 and Ni interface.When the rest condition was same, Ni₃Ti phase was produced at the interface zone at 800℃;and there appeared Ni₃Ti and NiTi phases at 850℃;and there produced NiTi₂, Ni₃Ti and NiTi phases at 880℃.The strength of the joint lied on types and thickness of nickel and titanium intermetallic compounds.