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YUAN Jie, ZHAO Ning, NAN Junma, XU Kewei. Bonding interface of containing-Ti prealloy based CuMn and diamond grit via brazing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (6): 69-72.
Citation: YUAN Jie, ZHAO Ning, NAN Junma, XU Kewei. Bonding interface of containing-Ti prealloy based CuMn and diamond grit via brazing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (6): 69-72.
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Bonding interface of containing-Ti prealloy based CuMn and diamond grit via brazing

  • State Key Laboratory of Mechanical Behavior for Materials, Xi'an Jiaotong University, Xi'an 710049, China

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  • Received Date: July 18, 2006
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  • A containing-Ti prealloyed powder was designed to be used as an adhesion matrix to increase the diamond retention, and then made from the Cu and Mn by gas atomization.An analysis was made to the metal-diamond bonding interface after the bulk composites being hot-pressed in rough vacuum brazing, which is produced according to the characteristics of the containing-Ti powder with the melting temperature (about 1 151 K)determined by thermal analyzer, and the liquidity and spreadability were observed experimentally. It was found that the discrete island-shaped TiC occurs on the diamond surface, and the contents of Ti and C change obviously in both sides of the interface with Ti rich in the region closed to the diamond and C rich in the region closed to a matrix, because of the chemical reaction based on the introduction of a strong carbide-forming element Ti to the prealloyed powders.
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